Previously, a ceramic substrate (or DBC) was used to provide voltage isolation and thermal conductivity. Because each material has a different coefficient of thermal expansion (CTE), the material interfaces are under stress each time that the module heats and cools. The repeated stress eventually produces a crack that worsens thermal conductivity and leads to failure of the module. The version 6 DIPIPM uses a proprietary resin to provide voltage isolation and thermal conductivity. This resin cures along with the transfer mold resin. Because the resins have matching CTE, there is no appreciable stress as the module heats and cools. Therefore the mechanism that causes thermal cycle failure is essentially eliminated, and version 6 DIPIPM is appropriate for applications that require long lifetime.