MaxiGrip Board Rework

maxiGRIP™ and Board Rework Costs

Advanced Thermal Solutions Inc

This tutorial discusses use of the latest technology to attach heat sinks to BGA devices that minimizes potential damage to either the component or the PCB itself during the rework process.

Related Parts

ImagenNúmero de pieza del fabricanteDescripciónMétodo de conexiónFormaCantidad disponiblePrecioVer detalles
HEAT SINK 27MM X 27MM X 12.5MMATS-52270G-C1-R0HEAT SINK 27MM X 27MM X 12.5MMCinta térmica adhesiva (incluida)Aletas cuadradas en ángulo100 - Inmediata$11.55Ver detalles
HEAT SINK 25MM X 25MM X 14.5MMATS-51250K-C1-R0HEAT SINK 25MM X 25MM X 14.5MMClip, material térmicoAletas cuadradas en ángulo0 - Inmediata$12.50Ver detalles
HEAT SINK 33MM X 33MM X 7.5MMATS-52330B-C1-R0HEAT SINK 33MM X 33MM X 7.5MMCinta térmica adhesiva (incluida)Aletas cuadradas en ángulo187 - Inmediata$10.26Ver detalles
HEAT SINK 27MM X 27MM X 14.5MMATS-53270K-C1-R0HEAT SINK 27MM X 27MM X 14.5MMClip, material térmicoCuadrado, aletas607 - Inmediata$14.69Ver detalles
HEAT SINK 25MM X 25MM X 12.5MMATS-50250G-C1-R0HEAT SINK 25MM X 25MM X 12.5MMClip, material térmicoAletas cuadradas en ángulo935 - Inmediata$15.30Ver detalles
HEAT SINK 23MM X 23MM X 12.5MMATS-50230G-C1-R0HEAT SINK 23MM X 23MM X 12.5MMClip, material térmicoAletas cuadradas en ángulo65 - Inmediata$15.11Ver detalles
HEAT SINK 19MM X 19MM X 12.5MMATS-50190G-C1-R0HEAT SINK 19MM X 19MM X 12.5MMClip, material térmicoAletas cuadradas en ángulo32 - Inmediata$14.87Ver detalles
HEAT SINK 21MM X 21MM X 12.5MMATS-50210G-C1-R0HEAT SINK 21MM X 21MM X 12.5MMClip, material térmicoAletas cuadradas en ángulo100 - Inmediata$14.97Ver detalles
HEAT SINK 19MM X 19MM X 9MMATS-56001-C1-R0HEAT SINK 19MM X 19MM X 9MMCinta térmica adhesiva (incluida)Aletas cuadradas en ángulo1764 - Inmediata$7.80Ver detalles
PTM Published on: 2011-10-13

Related Videos

ATS Explains - Thermal Interface Material
ATS Explains - Thermal Interface Material

Fecha de publicación: 2018-01-26

Advanced Thermal Solutions - maxiGRIP
Advanced Thermal Solutions - maxiGRIP

Fecha de publicación: 2012-10-15

Related Product Highlight

Soluciones de fijación para disipadores térmicos Los accesorios del disipador térmico de Advanced Thermal Solutions brindan a los ingenieros múltiples opciones para conectar mecánicamente casi cualquier disipador térmico a las placas CI.
maxiFLOW™ with maxiGRIP™ Heatsinks ATS BGA cooling solutions with maxiGRIP attachment come preassembled with phase change thermal interface materials for easy installation/removal.

Related Articles and Blogs

Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.
Air Flow Measurement in Electronic Systems An analysis of circuit board air flow measurement techniques and the considerations required to obtain an accurate reading in this complex environment.

Related Product Training Modules

Introduction to Heat Sinks This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.
maxiGRIP™ Flip-Chip Overview of the maxiGRIP Flip-Chip and review of importance of selecting the correct TIM.
Phase Change - Pressure Increase maxiGRIP™ ATS maxiGRIP and superGRIP are ideal solutions when used with phase change TIM for increased thermal and mechanical performance.