Solder preforms, wire, and ribbon are manufactured and packaged to minimize oxidation. Since no container offers complete isolation from oxygen in ambient air, solder will slowly oxidize, which may result in a reduction in wetting.

The alloys in this book are the result of decades of listening to our customers and finding solutions that enable cutting-edge technologies

Metal Thermal Interface Materials (TIMs) aid in the transfer of heat between surfaces and minimize the thermal resistance at each device connection.

For high-power devices, the performance of interconnect materials within the packaging is critical to achieve efficiency and longevity.

The automotive industry, emerging electric vehicles, and wafer-level packages with smaller pitch sizes demand higher reliability of solder joints, namely, the elongated lifetime and/or the survival of more aggressive service conditions, than the mainstream SAC305.

The theoretical volume of solder paste can be calculated for each board using the Greely Formula and a simple volume calculation.

Durafuse® LT serves as a high-reliability solution to several different application challenges employing a vast array of reflow processes to achieve different results.

Indium metal is extracted primarily from indium-bearing zinc or tin ores and purified to various grades utilizing state-of-the-art statistical process-controlled refining technologies.

Indium flux and solder compatibility application note.

Reducing the energy consumed by the reflow oven has a direct impact on reduced CO2 emissions. In addition to quantifying the energy consumed, there is a growing emphasis on the Life Cycle Assessment (LCA) of a product.

A manufacturer can choose either a rosin-containing or a non-rosin-containing flux based on the solvent used, the ratio of flux to solvent, and the current cleaning process, to name a few.

One of the biggest challenges facing the electronics industry today is voiding in the solder joints that connect bottom terminated components to PCBs.

Indium Corporation manufactures bar solder to surpass the strict quality demands of the surface mount industry, providing more consistent, reliable performance.

El alambre de soldadura sólido de Indium Corporation se fabrica para cumplir con los exigentes estándares de calidad de ASTM B-32, J-STD-006 y JIS-Z-3282.

El CW-807 es compatible con todas las pastas de soldadura sin limpieza, fundentes por onda y aleaciones de soldadura blandas comunes de Indium Corporation.

Los chips de soldadura de barra de indio son pequeñas piezas de soldadura de barra de grado electrónico que se utilizan para llenar recipientes más pequeños o para acelerar la fusión de la soldadura en un nuevo crisol de soldadura.

La pasta de soldadura soluble en agua Indium6.6HF de Indium es capaz de procesos de ensamblaje sin SnPb y Pb con una ventana de proceso de reflujo excepcional.

El alambre con núcleo CW-219 altamente activado, de alto rendimiento y sin limpieza de Indium es ideal para la soldadura robótica y manual de superficies muy oxidadas.

Las plumas de fundente de Indium tecnológicamente avanzados contienen cada uno 10 ml de fundente y cuentan con una capacidad excepcional de control de fugas y dispensación.

El alambre tubular CW-818 de Indium presenta propiedades resistentes al calor y de baja salpicadura, lo que proporciona un conjunto con una excelente apariencia visual.