zSFP+ Stacked Interconnects

TE's zSFP+ stacked interconnects accommodate 3-row belly-to-belly applications for increased density and maximum PCB space savings

Image of TE Amp's zSFP+ Stacked Interconnects TE's zSFP+ stacked interconnects are designed to transfer data rates at up to 56 Gbps PAM-4 while offering high faceplate density for hyperscale data centers and networking switch applications. Alternatively, users can design-in the zSFP+ connector for 10 Gbps to 16 Gbps data rates, establishing a progressive path to higher speeds. This upgradeability can result in long-term cost savings as this would eliminate the need to fully redesign for higher performance. The stacked portfolio can accommodate 3-row belly-to-belly applications for increased density and maximum PCB space savings.

Features

  • Data rates: Up to 28 Gbps NRZ and 56 Gbps PAM-4, 10 Gbps Ethernet, and 16 Gbps Fibre Channel
  • Surface-mount connector design for single high 1xN cages
  • Press-fit 1xN cages and stacked assemblies (connector and cage) for one-step, easy PCB placement
  • Coupled, narrow-edged, blanked- and formed-contact beam geometry and insert molding for superior signal integrity, mechanical, and electrical performance
  • Backward-compatibility: Shares same mating interface and cage dimensions with the SFP+ connector (connector/single high cages are also PCB footprint-compatible)
  • Elastomeric gasket or spring finger options for EMI containment
  • Single high cages (1xN) for design flexibility; accommodates belly-to-belly applications for increased density and PCB space savings; available in 1x1, 1x2, 1x3, 1x4, or 1x6 port configurations
  • Stacked assemblies offered in 2x1, 2x2, 2x4, 2x6, 2x8, or 2x12 port
  • Heat sinks, LEDs, and plating choices offered
  • Additional light pipe configurations available

Key Benefits

  • Each of the products in TE's SFP portfolio of I/O interconnects is designed to transfer data at speeds of up to 28 Gbps NRZ and 56 Gbps PAM-4 signal
  • The stacked portfolio can accommodate 3-row belly-to-belly applications for increased density and maximum PCB space savings
  • Share the same mating interface and cage dimensions with the entire SFP28 portfolio
  • Allow for a simple upgrade path from 28 Gbps to 56 Gbps applications
  • Enhanced airflow cage design can provide great thermal performance and can be customized to address customer's LED light pipe requirements
Applications
  • Switches
  • Servers
  • Routers
  • Storage
  • Test equipment
  • Data centers
  • Networking

zSFP+ Stacked Interconnects

ImageManufacturer Part NumberDescriptionNumber of PositionsTerminationContact Finish ThicknessAvailable QuantityPriceView Details
CONN RCPT ZSFP+ 40POS PRESS R/A2349202-5CONN RCPT ZSFP+ 40POS PRESS R/A40 (20 x 2)Press-Fit-18 - Immediate
232 - Marketplace
$34.39View Details
CONN RCPT ZSFP+ 40POS PRESS R/A2349202-6CONN RCPT ZSFP+ 40POS PRESS R/A40 (20 x 2)Press-Fit-129 - Immediate$35.44View Details
CONN RCPT ZSFP+ 40POS PRESS R/A2349202-7CONN RCPT ZSFP+ 40POS PRESS R/A40 (20 x 2)Press-Fit-60 - Immediate$35.25View Details
CONN RCPT ZSFP+ 40POS PRESS R/A2349202-8CONN RCPT ZSFP+ 40POS PRESS R/A40 (20 x 2)Press-Fit-2 - Immediate
99 - Marketplace
$35.46View Details
CONN RCPT ZSFP+ 40POS PRESS R/A1-2349202-9CONN RCPT ZSFP+ 40POS PRESS R/A40 (20 x 2)Press-Fit-0 - Immediate
51 - Marketplace
$35.98View Details
Published: 2019-11-15