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TS391SNL250 | |
|---|---|
DigiKey Part Number | TS391SNL250-ND |
Manufacturer | |
Manufacturer Product Number | TS391SNL250 |
Description | THERMALLY STABLE SOLDER PASTE NO |
Manufacturer Standard Lead Time | 3 Weeks |
Customer Reference | |
Detailed Description | Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g) |
Datasheet | Datasheet |
Product Attributes
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Category | Mesh Type 4 |
Manufacturer Chip Quik Inc. | Process Lead Free |
Packaging Bulk | Form Jar, 8.8 oz (250g) |
Part Status Active | Shelf Life 12 Months |
Type Solder Paste | Shelf Life Start Date of Manufacture |
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Storage/Refrigeration Temperature 68°F ~ 77°F (20°C ~ 25°C) |
Melting Point 423 ~ 428°F (217 ~ 220°C) | Base Product Number |
Flux Type No-Clean |
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All prices are in USD
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| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | $69.95000 | $69.95 |
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