Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 8.8 oz (250g)
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SMD291AX250T3

DigiKey Part Number
SMD291AX250T3-ND
Manufacturer
Manufacturer Product Number
SMD291AX250T3
Description
SOLDER PASTE SN63/PB37 250G
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 8.8 oz (250g)
Datasheet
 Datasheet
Product Attributes
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Category
Process
Leaded
Manufacturer
Chip Quik Inc.
Form
Jar, 8.8 oz (250g)
Packaging
Bulk
Shelf Life
12 Months
Part Status
Active
Shelf Life Start
Date of Manufacture
Type
Solder Paste
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
Composition
Sn63Pb37 (63/37)
Digi-Key Storage
Refrigerated
Melting Point
361°F (183°C)
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Flux Type
No-Clean
Weight
0.551 lb (249.93 g)
Mesh Type
3
Base Product Number
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
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All prices are in USD
Bulk
QuantityUnit PriceExt Price
1$41.95000$41.95
Manufacturers Standard Package