The Laird Thermal Materials Tflex™ CR910 is a two-part dispensable gap filler that provides low thermal resistance and high reliability.
Tark Thermal Solutions OptoTEC MSX series multistage thermoelectric coolers maximize image resolution and reduce thermal noise in imaging systems.
Medical and healthcare applications and components
Publish Date: 2026-02-19
Murata partners with companies worldwide to integrate advanced sensing, power, connectivity solutions, and more into compact, reliable, medical grade devices.
The ebm-papst AxiForce series is rated up to IP68 and available in sizes of 40 mm, 80 mm, 120 mm, and 172 mm for maximum versatility.
CM5 Active Cooler: The Ultimate Heat Solution for Raspberry Pi CM5
Publish Date: 2025-01-15
The EDATEC CM5 active cooler reduces the temperature of the Raspberry Pi CM5 CPU, Wi-Fi® module, and power management chip for stable operation and longer life.
ATS thermal solutions for NVIDIA® Jetson THOR™ SoMs feature ready-to-install mounting hardware and thermal interface material.
Advanced Thermal Solutions cooling solutions for the AMD Kria™ K24 SOM deliver advanced, versatile thermal management across all potential power levels.
ulTIMiFlux Thermal Interface Material
Updated: 2025-11-03
Wakefield Thermal's ulTIMiFlux line of thermal interface materials offer high performance, low cost, configurability, and custom sizes for your thermal system needs.
Advanced Liquid Cooling Systems
Updated: 2025-09-11
Tark Thermal Solutions advanced liquid cooling systems are designed to meet the demands of modern high-power electronics.
T-Global silicone-based low bleed series thermal pads incorporate high performance and maintained stability alongside advanced oil bleed technology.
Rack-Mounted Cooling Systems (Self-Cooling Racks)
Publish Date: 2025-08-29
Tripp Lite by Eaton rack-mounted close-coupled cooling improves energy efficiency and avoids hot spots.
IT-Grade Portable Air Conditioners
Publish Date: 2025-08-29
Tripp Lite by Eaton IT-Grade portable air conditioning units pack powerful cooling into a compact footprint.
The T-Global Technology TG-ASD35AB fast-curing silicone-based thermal gel provides a high-elasticity formulation to ensure a secure fit.
MFC0251V2-1Q02U-S99 White PC Case Fan
Publish Date: 2025-08-25
Sunon MFC0251V2-1Q02U-S99 120 mm x 25 mm axial fan is engineered for compact systems where both thermal performance and visual appeal matter.
The Orion Fans OD254 254 mm DC fan with UL60079 safety standard is engineered for demanding and hazardous environments.
The T-Global OB vapor chamber is an efficient, ultra-thin passive heat spreading solution for high-performance electronics.
Dual-Sided, High-Flow Cold Plates
Publish Date: 2025-07-14
The ATS-THCP-1000 is a state-of-the-art dual-sided, high-flow cold plate engineered by ATS to provide exceptional thermal management for high-power electronics.
THERM-A-GAP™ PAD 80LO Thermally Conductive Gap Filler Pads
Publish Date: 2025-07-02
Parker Chomerics THERM-A-GAP™ PAD 80LO thermally conductive gap filler pads provide a low hardness (35 Shore 00) solution with thermal conductivity of 8.3 W/mK.
Peripheral Accessories
Publish Date: 2025-06-04
Explore MEAN WELL's versatile peripheral accessories, including DC barrel plug adapters designed for easy customization of power supply connections in prototyping and development projects.
Thermal Management Solutions
Updated: 2025-06-02
Same Sky's thermal management line addresses the increasing thermal challenges in today's board-level electronic applications.

