TEA1532(A), P, T Datasheet by NXP USA Inc.

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PHILIPS
1. General description
The GreenChip™II is the second generation of green Switched Mode Power Supply
(SMPS) controller ICs. Its high level of integration allows the design of a cost effective
power supply with a very low number of external components.
The TEA1532(A)P; TEA1532(A)T can also be used in fixed frequency, Continuous
Conduction Mode (CCM) converter designs for low voltage, high current applications. At
low power (standby) levels, the system operates in cycle skipping mode which minimizes
the switching losses during standby.
The special built-in green functions allow the efficiency to be optimum at all power levels.
This holds for quasi-resonant operation at high power levels, as well as fixed frequency
operation with valley switching at medium power levels. At low power (standby) levels, the
system operates in cycle skipping mode with valley detection.
The proprietary high voltage BCD800 process makes direct start-up possible from the
rectified universal mains voltage in an effective and green way. A second low voltage
BICMOS IC is used for accurate, high speed protection functions and control.
The TEA1532(A)P; TEA1532(A)T enables highly efficient and reliable supplies to be
designed easily.
2. Features
2.1 Distinctive features
Universal mains supply operation (70 V to 276 V AC)
High level of integration, resulting in a very low external component count
Fixed frequency Continuous Conduction Mode (CCM) operation capability
Quasi-Resonant (QR) Discontinuous Conduction Mode (DCM) operation capability.
2.2 Green features
Valley or zero voltage switching for minimum switching losses in QR operation
Cycle skipping mode at very low loads; input power < 300 mW at no-load operation for
a typical adapter application
On-chip start-up current source.
2.3 Protection features
Safe restart mode for system fault conditions
Zero current switch-on in QR mode
TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
Rev. 02 — 4 February 2005 Product data sheet
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 2 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
Undervoltage protection (foldback during overload)
IC OverTemperature Protection (OTP) (latched)
Low and adjustable OverCurrent Protection (OCP) trip level
Soft (re)start
Mains voltage-dependent operation-enabling level
TEA1532AP and TEA1532AT: General purpose input for latched or safe restart
protection and timing, e.g. to be used for overvoltage protection (OVP), output
short-circuit protection or system OTP.
TEA1532P and TEA1532T: General purpose input for latched protection and timing,
e.g. to be used for OVP, output short-circuit protection or system OTP.
Brown-out protection.
3. Applications
Printer adapters and chargers. The device can also be used in all applications that
demand an efficient and cost-effective solution up to 250 W.
4. Ordering information
Table 1: Ordering information
Type number Package
Name Description Version
TEA1532T SO8 plastic small outline package; 8 leads; body
width 3.9 mm SOT96-1
TEA1532AT
TEA1532P DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
TEA1532AP
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 3 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
5. Block diagram
(1) Switch S3 is not controlled in the TEA1532T and TEA1532P (fixed as drawn).
Fig 1. Block diagram
SUPPLY
MANAGEMENT
internal
supply UVLO start
Vm
VCC 1
2
4
GND
S1
CTRL
OSCILLATOR
DCM
AND
CCM
DETECTION
LOGIC
LOGIC
BROWN-OUT
PROTECTION
soft
start
S2
OVER-
TEMPERATURE
PROTECTION
SQ
R
UVLO Q
MAXIMUM
ON-TIME
PROTECTION
POWER-ON
RESET
1
VALLEY
80
mV
clamp
DRIVER
START-UP
CURRENT SOURCE
0.5 V
6SENSE
7DRIVER
coa014
5DEM
8DRAIN
OCP
LEB
blank
Iss
Islopecomp
0.63 V
SQ
R
VCC < 4.5 V Q
50
mV
Iprot(dem)
TEA1532T
TEA1532AT
TEA1532P
TEA1532AP
Osc_Rdy
Duty_Max
SLOPE
COMPENSATION
5.6 V
control
detect
Icharge
3
PROTECT
5.6 V
Idischarge
300
protect
detect
3 V
2.5 V
S3
(1)
DCM and CCM
jjjj CECE jjjj CECE
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 4 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
6. Pinning information
6.1 Pinning
6.2 Pin description
7. Functional description
The TEA1532(A)P; TEA1532(A)T is the controller of a compact flyback converter, with the
IC situated at the primary side. An auxiliary winding of the transformer provides
demagnetization detection and powers the IC after start-up; see Figure 4.
Fig 2. Pin configuration: TEA1532(A)T
(SOT96-1) Fig 3. Pin configuration: TEA1532(A)P
(SOT97-1)
TEA1532T
TEA1532AT
VCC DRAIN
GND DRIVER
PROTECT SENSE
CTRL DEM
001aaa829
1
2
3
4
6
5
8
7TEA1532P
TEA1532AP
VCC DRAIN
GND DRIVER
PROTECT SENSE
CTRL DEM
001aaa828
1
2
3
4
6
5
8
7
Table 2: Pin description
Symbol Pin Description
VCC 1 supply voltage
GND 2 ground
PROTECT 3 protection and timing input
CTRL 4 control input
DEM 5 input from auxiliary winding for demagnetization timing
SENSE 6 programmable current sense input
DRIVER 7 MOSFET gate driver output
DRAIN 8 drain of the external MOS switch, input for start-up current and
valley sensing
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 5 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
The TEA1532(A)P; TEA1532(A)T can operate in multi modes; see Figure 5.
In QR mode, the next converter stroke is started only after demagnetization of the
transformer current (zero current switching), while the drain voltage has reached the
lowest voltage to minimize switching losses (green function). The primary resonant circuit
of primary inductance and drain capacitor ensures this quasi-resonant operation. The
design can be optimized in such a way that zero voltage switching can extend over most of
the universal mains range.
To prevent very high frequency operation at lower loads, the quasi-resonant operation
changes smoothly in fixed frequency Pulse Width Modulation (PWM) control.
Fig 4. Typical configuration
Fig 5. Multi mode and FF-CCM operation
coa015
1
CVCC
CVIN
Vi
2
3
4
8
7
6
5
TEA1532T
TEA1532AT
TEA1532P
TEA1532AP
Cycle
skip fixed FF-CCM
P (W)
coa017
f
(kHz)
63
QR
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 6 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
In fixed frequency continuous conduction mode, which can be activated by grounding
pin DEM, the internal oscillator determines the start of the next converter stroke.
In both operating modes, a cycle skipping mode is activated at very low power (standby)
levels.
7.1 Start-up, mains enabling operation level and undervoltage lock out
Refer to Figure 10 and Figure 11. Initially, the IC is self supplying from the rectified mains
voltage via pin DRAIN. Supply capacitor CVCC (at pin 1) is charged by the internal start-up
current source to a level of about 4 V or higher, depending on the drain voltage. Once the
drain voltage exceeds the Vm (mains-dependent operation-enabling level), the start-up
current source will continue charging capacitor CVCC (switch S1 will be opened); see
Figure 1. The IC will activate the power converter as soon as the voltage on pin VCC
passes the Vstart level. At this moment the IC supply from the high voltage pin is stopped
(green function). The IC supply is taken over by the auxiliary winding of the flyback
converter.
The moment the voltage on pin VCC drops below VUVLO (undervoltage lock out), the IC
stops switching and performs a safe restart from the rectified mains voltage. In the safe
restart mode the driver output is disabled and pin VCC voltage is recharged via pin DRAIN.
7.2 Supply management
All (internal) reference voltages are derived from a temperature compensated, on-chip
band gap circuit.
7.3 Current control mode
Current control mode is used for its good line regulation behavior.
The on-time is controlled by an internal control voltage, which is compared with the
primary current information. The primary current is sensed across an external resistor.
The driver output is latched in the logic, preventing multiple switch-on.
The internal control voltage is inversely proportional to the external pin CTRL voltage, with
an offset of 1.5 V. This means that a voltage range from 1 V to approximately 1.5 V on
pin CTRL will result in an internal control voltage range from 0.5 V to 0 V (a high external
control voltage results in a low duty cycle).
Fig 6. The Vsense(max) voltage as a function of VCTRL
VCTRL (V)
1 V
(typ)
0.52 V
1.5 V
(typ)
coa016
Vsense(max) (V)
Cycle
skip
active
25 mV
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 7 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
7.4 Oscillator
The fixed frequency of the oscillator is set by an internal current source and capacitor.
7.5 Cycle skipping
At very low power levels, a cycle skipping mode activates. An internal control voltage
(Vsense(max)) lower than 25 mV will inhibit switch-on of the external power MOSFET until
this voltage increases to a higher value; see Figure 6.
7.6 Demagnetization (QR operation)
The system will be in Discontinuous Conduction Mode (DCM) (QR operation) when
resistor RDEM is applied. The oscillator will not start a new primary stroke until the previous
secondary stroke has ended.
Demagnetization features a cycle-by-cycle output short-circuit protection which
immediately reduces the frequency (longer off-time), thereby reducing the power level.
Demagnetization recognition is suppressed during the first tsupp time (typical 1.5 µs). This
suppression may be necessary in applications where the transformer has a large leakage
inductance and at low output voltages or start-up.
7.7 Continuous Conduction Mode (CCM)
It is also possible to operate the IC in the so-called Fixed Frequency Continuous
Conduction Mode (FF CCM). This mode is activated by connecting pin DEM to ground
and connecting pin DRAIN to the rectified Vi voltage; see Figure 13.
7.8 OverCurrent Protection (OCP)
The primary current in the transformer is measured accurately by the internal
cycle-by-cycle source current limit circuit using the external sense resistor Rsense.
The accuracy of the current limit circuit allows the transformer core to have a minimum
specification for the output power required. The OCP circuit limits the ‘sense’ voltage to an
internal level (the primary peak current in the transformer is also limited). The OCP
detection is suppressed during the leading edge blanking period, tleb generated by the
Leading Edge Blanking (LEB) circuit, to prevent false triggering caused by the switch-on
spikes.
7.9 Control pin protection
If pin CTRL becomes open-circuit or is disconnected, a fault condition is assumed and the
converter will stop switching immediately. Operation recommences when the fault
condition is removed.
7.10 Adjustable slope compensation
A slope compensation function has been added at pin CTRL; see Figure 7. The slope
compensation function prevents sub-harmonic oscillation in CCM at duty cycles over
50 %. The CTRL voltage is modulated by sourcing a (non-constant) current out of
pin CTRL and by adding externally a series resistor Rslopecomp. This increases the CTRL
voltage proportionally with the on-time, which therefore limits the OCP level. A longer
on-time results in a higher CTRL voltage, this increase in CTRL voltage will decrease the
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 8 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
on-time. Slope compensation can be adjusted by changing the value of Rslopecomp. Slope
compensation prevents modulation of the on-time (duty cycle) while operating in FF CCM.
A possible drawback of sub-harmonic oscillation can be output voltage ripple.
The source current of pin CTRL is always active. In QR mode, the Rslopecomp resistor is
replaced by a short, so the modulation of the CTRL voltage is almost negligible.
7.11 Minimum and maximum on-time
The minimum on-time of the SMPS is determined by the LEB time (typical 400 ns). The IC
limits the on-time to a maximum time which is dependent on the mode of operation:
QR mode: When the system requires an ‘on-time’ of more than 25 µs, a fault condition is
assumed, the IC stops switching and enters the safe restart mode.
CCM: The driver duty cycle is limited to 70 %. So the maximum on-time is correlated to
the oscillator time which results in an accurate limit of the minimum input voltage of the
flyback converter.
7.12 PROTECT and timing input
The PROTECT input (pin 3) is a multi-purpose (high-impedance) input, which can be used
to switch off the IC and create a relatively long timing function. As soon as the voltage on
this pin rises above 2.5 V, switching stops immediately. For the timing function, a current of
typically 50 µA flows out of pin PROTECT and charges an external capacitor until the
activation level of 2.5 V is reached. This current source is only activated when the
converter is not in regulation, which is detected by the voltage on pin CTRL
(VCTRL < 0.63 V). A (small) discharge current is also implemented to ensure that the
capacitor is not charged, for example, by spikes A MOSFET switch is added to discharge
the external capacitor and ensure a defined start situation. For the TEA1532AP and the
TEA1532AT, the voltage on pin CTRL determines whether the IC enters latched protection
mode, or safe restart protection mode:
Fig 7. Slope compensation
001aaa830
CTRL 1
Slope compensation
current
0.63 V
control
detect
5.6 V
4
RCTRL
Rslopecomp
2xn>< l="" xc="">
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 9 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
When the voltage on pin CTRL is below 0.63 V, the IC is assumed to be out of
regulation (e.g. the control loop is open). In this case activating pin PROTECT
(VPROTECT > 2.5 V) will cause the converter to stop switching. Once VCC drops below
VUVLO, capacitor CVCC will be recharged and the supply will restart. This cycle will be
repeated until the fault condition is removed (safe restart mode).
When the voltage on pin CTRL is above 0.63 V, the output is assumed to be in
regulation. In this case activating pin PROTECT (VPROTECT > 2.5 V), by external
means, will activate the latch protection of the IC: The voltage on pin VCC will cycle
between Vstart and VUVLO, but the IC will not start switching again until the latch
protection is reset. The latch is reset as soon as VCC drops below 4.5 V (typical value)
(this only occurs when the mains has been disconnected). The internal
overtemperature protection will also trigger this latch; see also Figure 1.
For the TEA1532P and the TEA1532T the IC always enters the latched mode protection
independent of the voltage on pin CTRL.
A voltage higher than 3 V on pin PROTECT will always latch the IC. This is independent of
the state of the IC.
7.13 Valley switching
Refer to Figure 8. A new cycle starts when the power switch is activated. After the on-time
(determined by the sense voltage and the internal control voltage), the switch is opened
and the secondary stroke starts. After the secondary stroke, the drain voltage shows an
oscillation with a frequency of approximately
where Lp is the primary self inductance of the transformer and Cd is the capacitance on
the drain node.
As soon as the oscillator voltage is high again and the secondary stroke has ended, the
circuit waits for the lowest drain voltage before starting a new primary stroke. This method
is called valley detection. Figure 8 shows the drain voltage, valley signal, secondary stroke
signal and the oscillator signal.
In an optimum design, the reflected secondary voltage on the primary side will force the
drain voltage to zero. Thus, zero voltage switching is possible, preventing large capacitive
switching losses , and allowing high frequency operation, which
results in small and cost effective magnetics.
1
2π× LpCd
××
------------------------------------------
P1
2
---CV
2
×f××=


9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 10 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
7.14 Brown-out protection
During the so called brown-out test, the input voltage is slowly decreased. Since the
on-time depends on Vi, long on-times at low Vi can damage the (external) power device.
This is prevented by stopping the converter when the input voltage drops too low.
When the voltage on pin DEM drops below 50 mV during the on-time (QR mode), the
maximum on-time is set to 25 µs. The maximum on-time will be reached while Vi is low.
Subsequently, the IC stops switching and VCC drops below VUVLO. Capacitor CVCC will
only be recharged and the supply will restart only when voltage Vi is high enough (Vm,
also see Section 7.1). In addition to this, a Vi level at which the converter has to enter a
safe restart can be set with a demagnetization resistor. During the primary stroke, the
rectified mains input voltage is measured by sensing the current drawn from pin DEM.
This current depends on the mains voltage, according to the following formula:
Where:
The latter function requires an on-time of at least 2 µs. This on-time ensures that a reliable
demagnetization current can be measured.
(1) Start of new cycle at lowest drain voltage.
(2) Start of new cycle in a classical PWM system at high drain voltage.
Fig 8. Signals for valley switching
drain
secondary
stroke
mgu235
secondary
ringing
primary
stroke
valley
(2) (1)
secondary
stroke
oscillator
IDEM()
Vaux
RDEM
---------------NV
mains
×
RDEM
--------------------------
≈≈
NNaux
Np
------------
=
9?? *
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 11 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
When pin DEM is grounded (CCM), the brown-out protection is disabled. In this case the
duty cycle is limited to 0.7, so at low mains voltage the on-time is limited and therefore the
dissipation in the FET is limited.
7.15 OverTemperature protection (OTP)
The IC provides accurate OTP. The IC will stop switching when the junction temperature
exceeds the thermal shutdown temperature. When VCC drops to VUVLO, capacitor CVCC
will be recharged to the Vstart level, however switching will not restart. Subsequently, VCC
will drop again to VUVLO, etc.
Operation only recommences when VCC drops below a level of about 4.5 V (typically,
when Vmains is disconnected for a short period).
7.16 Soft start-up (pin SENSE)
To prevent transformer rattle at start-up or during hiccup, the transformer peak current is
slowly increased by the soft start function. This can be achieved by inserting a resistor
and a capacitor between pin SENSE (pin 6) and sense resistor Rsense. An internal current
source charges the capacitor to Vsense =I
ss ×Rss (about 0.5 V maximum).
The start level and the time constant of the increasing primary current level can be
adjusted externally by changing the values of Rss and Css.
During the start-up phase, the charging current Iss will flow as long as the voltage on
pin SENSE is below approximately 0.5 V. If the voltage on pin SENSE exceeds 0.5 V, the
soft start current source will start limiting current Iss. At Vstart, the Iss current source is
completely switched off; see Figure 9.
Since the soft start current Iss is subtracted from pin VCC charging current, the Rss value
will affect VCC charging current level by a maximum of 60 µA (typical).
Fig 9. Soft start-up
Iprimary(max)
Vocp Iss Rss
×()
Rsense
------------------------------------------
=
τRss Css
×=
Css
Rss
SENSE
Rsense
Iss
Vocp
start-up
mgu237
6
0.5 V
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 12 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
7.17 Driver
The driver circuit to the gate of the power MOSFET has a current sourcing capability of
typically 170 mA and a current sink capability of typically 700 mA at VCC of 9.5 V. At
VCC = 15 V, the current sourcing capability is typically 300 mA and the current sink
capability typically 1.2 A. This permits fast turn-on and turn-off of the power MOSFET for
efficient operation.
A low driver source current has been chosen to limit the V/t at switch-on. This reduces
Electro Magnetic Interference (EMI) and also limits the current spikes across Rsense.
8. Limiting values
[1] Equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
[2] Equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 resistor.
Table 3: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured
with respect to ground (pin 2); positive currents flow into the chip; pin V
CC
may not be current driven.
The voltage ratings are valid provided other ratings are not violated; current ratings are valid
provided the maximum power rating is not violated.
Symbol Parameter Conditions Min Max Unit
Voltages
VCC supply voltage continuous 0.4 +20 V
VPROTECT voltage on pin PROTECT continuous 0.4 +5 V
VCTRL voltage on pin CTRL 0.4 +5 V
VDEM voltage on pin DEM current limited - - V
VSENSE voltage on pin SENSE current limited 0.4 - V
VDRAIN voltage on pin DRAIN 0.4 +650 V
Currents
ICTRL current on pin CTRL d < 10 % - 50 mA
IDEM current on pin DEM 1000 +250 µA
ISENSE current on pin SENSE 1 +10 mA
IDRIVER current on pin DRIVER d < 10 % 0.8 +2 A
IDRAIN current on pin DRAIN - 5 mA
General
Ptot total power dissipation Tamb <70°C
SO8 package - 0.5 W
DIP8 package - 0.75 W
Tstg storage temperature 55 +150 °C
Tjjunction temperature 20 +145 °C
ESD
VESD electrostatic discharge
voltage class 1
human body model pins 1 to 7 [1] - 2000 V
pin 8 (DRAIN) [1] - 1500 V
machine model [2] - 200 V
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 13 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
9. Thermal characteristics
10. Characteristics
Table 4: Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-a) thermal resistance from
junction to ambient in free air; SO8 package 150 K/W
in free air; DIP8 package 95 K/W
Table 5: Characteristics
T
amb
=25
°
C; V
CC
= 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Start-up current source (pin DRAIN)
IDRAIN supply current drawn from
pin DRAIN VDRAIN > 100 V
VCC = 0 V 1.0 1.2 1.4 mA
with auxiliary supply - 100 300 µA
VBbreakdown voltage 650 - - V
Vmmains-dependent
operation-enabling level 60 - 100 V
Supply voltage management (pin VCC)
Vstart start-up voltage 10.3 11 11.7 V
VUVLO lock-out undervoltage 8.1 8.7 9.3 V
Vhys hysteresis voltage Vstart VUVLO 2.0 2.3 2.6 V
Ich(h) high charging current VDRAIN > 100 V; VCC <3V 1.2 10.8 mA
Ich(l) low charging current VDRAIN > 100 V;
3V<V
CC <V
UVLO
1.2 0.75 0.45 mA
Irestart restart current VDRAIN > 100 V;
VUVLO <V
CC <V
start
650 550 450 µA
Ioper supply current under normal
operation no load on pin DRIVER 1.1 1.3 1.5 mA
Demagnetization management (pin DEM)
Vth(DEM) demagnetization comparator
threshold voltage 50 80 110 mV
Vth(CCM) continuous conduction mode
detection threshold voltage 80 50 20 mV
Vclamp(neg) negative clamp voltage IDEM =500 µA0.5 0.45 0.40 V
Vclamp(pos) positive clamp voltage IDEM = 250 µA 0.5 0.7 0.9 V
tsupp suppression of transformer
ringing at start of secondary
stroke
1.1 1.5 1.9 µs
Pulse width modulator
ton(min) minimum on-time - tleb -ns
ton(max) maximum on-time QR mode 20 25 30 µs
δmax maximum duty-cycle 67 70 73 %
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 14 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
Oscillator
fosc oscillator frequency (fixed
frequency) VCTRL <1V 506375kHz
Duty cycle control (pin CTRL)
Vmin minimum voltage for maximum
duty cycle - 1.0 - V
Vmax maximum voltage for minimum
duty cycle - 1.5 - V
Islopecomp/t slope compensation current 1.2 10.8 µA/µs
VCTRL(detect) Control detect level 0.56 0.63 0.70 V
Protection and timing input (pin PROTECT)
Vtrip trip level [1] 2.37 2.5 2.63 V
Vtrip(latch) trip level for latch 2.85 3 3.15 V
VCC(latch)(reset) voltage level on pin VCC which
resets the latch VCC(latch) < 2.3 V - 4.5 - V
Icharge charge current VCTRL < 0.63 V 57 50 43 µA
Idischarge discharge current - 100 - nA
Valley switch (pin DRAIN)
V/tvalley valley recognition voltage
change 43 - +43 V/µs
tvalley-swon delay from valley recognition to
switch-on
[2] - 150 - ns
Overcurrent and winding short-circuit protection (pin SENSE)
Vsense(max) maximum source voltage for
OCP V/t = 0.1 V/µs 0.48 0.52 0.56 V
tPD propagation delay from
detecting Vsense(max) to
switch-off
V/t = 0.5 V/µs - 140 185 ns
tleb blanking time for current and
winding short-circuit protection 330 400 470 ns
Iss soft start current Vsense <0.5V 456075µA
Brown-out protection (pin DEM)
Ibrown-out brown-out protection current A constant Ibrown-out is drawn
from pin DEM.
[3] 68 60 52 µA
ton(min)(brown-out) minimum on-time for enabling
the brown-out protection. 1.5 2 2.5 µs
Driver (pin DRIVER)
Isource source current VCC = 9.5 V; VDRIVER =2V - 170 88 mA
Isink sink current VCC = 9.5 V
VDRIVER = 2 V - 300 - mA
VDRIVER = 9.5 V 400 700 - mA
Vo(max) maximum output voltage VCC > 12 V - 11.5 12 V
Table 5: Characteristics
…continued
T
amb
=25
°
C; V
CC
= 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 15 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
[1] TEA1532AP and TEA1532AT: safe restart; TEA1532P and TEA1532T: latch.
[2] Guaranteed by design.
[3] Vi detection level. Set by the demagnetization resistor RDEM; see Section 7.14.
[4] Valid for VCC >2V.
11. Application information
A converter with the TEA1532(A)P; TEA1532(A)T consists of an input filter, a transformer
with a third winding (auxiliary), and an output stage with a feedback circuit.
Capacitor CVCC buffers the IC supply voltage, which is powered via the internal current
source, that is connected to the rectified mains, during start-up and via the auxiliary
winding during operation.
A sense resistor Rsense converts the primary current into a voltage at pin SENSE. The
value of Rsense defines the maximum primary peak current.
Figure 10 shows a flyback configuration using the discontinuous conduction mode.
Pin PROTECT is used in this example for external overvoltage protection and open loop
or output short-circuit protection. If this pin is not used, it must be tied to ground. Figure 13
shows a flyback configuration using the continuous conduction mode. Pin PROTECT is
used in this example for external overtemperature protection and open loop or output
short-circuit protection.
Temperature protection
Tprot(max) maximum temperature
protection level 130 140 150 °C
Tprot(hyst) hysteresis for the temperature
protection level
[4] -8-°C
Table 5: Characteristics
…continued
T
amb
=25
°
C; V
CC
= 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 16 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
Fig 10. Flyback configuration using the discontinuous conduction mode
1
2
3
4
VCC
Vmains
Vi
RCTRL RDEM
Rsense
GND
PROTECT
CTRL
DRAIN
power
MOSFET
SENSE
DEM
8
7
6
5
DRIVER
Rss
Css
coa011
TEA1532T
TEA1532AT
TEA1532P
TEA1532AP
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 17 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
(1) In CCM, the brown-out protection is implemented by the maximum duty cycle in combination
with pin PROTECT.
Fig 11. Typical waveforms 1
001aaa840
VDRIVER
VPROTECT
Start-up
sequence Normal
operation OVP
(TEA1532A) Normal
operation Output
short-circuit
(TEA1532A)
Brown-out(1)
VCC
Vstart
VO
VDRAIN
Vi
Vi
VUVLO
2.5 V
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 18 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
(1) When VPROTECT is forced above 3 V, the protection is always latched. So the IC is not started at
Vstart unless the VCC voltage drops below the VCC(reset) level. This is the same action used for
external OTP compensation described in Section 7.15.
(2) External OTP for TEA1532T, TEA1532P, TEA1532AT and TEA1532AP; OVP and output short
circuit for TEA1532P and TEA1532T.
Fig 12. Typical waveforms 2
001aaa841
VDRIVER
VPROTECT(1)
Start-up
sequence Normal
operation
VCC
Vstart
VO
VDRAIN
Vi
Vi
VUVLO
2.5 V
Protection
active(2)
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 19 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
12. Test information
12.1 Quality information
The
General Quality Specification for Integrated Circuits, SNW-FQ-611
is applicable.
(1) Pin PROTECT is used in this example for external OTP and open loop or output short-circuit
protection. Slope compensation is determined by the value of Rslopecomp.
Fig 13. Flyback configuration using the continuous conduction mode
TEA1532T
TEA1532AT
TEA1532P
TEA1532AP
1
2
3
4
VCC
Vmains
Vi
RCTRL
Rsense
GND
PROTECT(1)
CTRL
DRAIN
power
MOSFET
SENSE
DEM
8
7
6
5
DRIVER
Rss
Css
coa013
Rslopecomp
E© MWH
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 20 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
13. Package outline
Fig 14. Package outline SOT96-1 (SO8)
UNIT A
max. A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.2
5.8 1.05 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
1.0
0.4
SOT96-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
4
5
pin 1 index
1
8
y
076E03 MS-012
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.05 0.244
0.228 0.028
0.024 0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
99-12-27
03-02-18
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 21 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
Fig 15. Package outline SOT97-1 (DIP8)
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT97-1 99-12-27
03-02-13
UNIT A
max. 12 b1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.14 0.53
0.38 0.36
0.23 9.8
9.2 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 1.154.2 0.51 3.2
inches 0.068
0.045 0.021
0.015 0.014
0.009
1.07
0.89
0.042
0.035 0.39
0.36 0.26
0.24 0.14
0.12 0.010.1 0.3 0.32
0.31 0.39
0.33 0.0450.17 0.02 0.13
b2
050G01 MO-001 SC-504-8
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
8
1
5
4
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 22 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
14. Soldering
14.1 Introduction
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering is often
preferred when through-hole and surface mount components are mixed on one
printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it
is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing.
14.2 Through-hole mount packages
14.2.1 Soldering by dipping or by solder wave
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C
or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
14.2.2 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 °C and 400 °C, contact may be up to 5 seconds.
14.3 Surface mount packages
14.3.1 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 °Cto270°C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
below 225 °C (SnPb process) or below 245 °C (Pb-free process)
for all BGA, HTSSON..T and SSOP..T packages
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 23 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
for packages with a thickness 2.5 mm
for packages with a thickness < 2.5 mm and a volume 350 mm3 so called
thick/large packages.
below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3.2 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45° angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C
or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
14.3.3 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270 °C and 320 °C.
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 24 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
14.4 Package related soldering information
[1] For more detailed information on the BGA packages refer to the
(LF)BGA Application Note
(AN01026); order a copy from your Philips
Semiconductors sales office.
[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with
respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of
the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods
.
[3] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
[4] Hot bar soldering or manual soldering is suitable for PMFP packages.
[5] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed
through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C±10 °C
measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible.
[6] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate
between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the
heatsink surface.
[7] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint
must incorporate solder thieves downstream and at the side corners.
[8] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for
packages with a pitch (e) equal to or smaller than 0.65 mm.
[9] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely
not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[10] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil.
However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate
soldering profile can be provided on request.
Table 6: Suitability of IC packages for wave, reflow and dipping soldering methods
Mounting Package [1] Soldering method
Wave Reflow [2] Dipping
Through-hole mount CPGA, HCPGA suitable −−
DBS, DIP, HDIP, RDBS, SDIP, SIL suitable[3] suitable
Through-hole-surface
mount PMFP [4] not suitable not suitable
Surface mount BGA, HTSSON..T [5], LBGA,
LFBGA, SQFP, SSOP..T [5],
TFBGA, VFBGA, XSON
not suitable suitable
DHVQFN, HBCC, HBGA, HLQFP,
HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable[6] suitable
PLCC [7], SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended [7] [8] suitable
SSOP, TSSOP, VSO, VSSOP not recommended [9] suitable
CWQCCN..L [10], WQCCN..L [10] not suitable not suitable
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 25 of 27
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
15. Revision history
Table 7: Revision history
Document ID Release date Data sheet status Change notice Doc. number Supersedes
TEA1532_2 20050204 Product data sheet - 9397 750 14319 TEA1532_1
Modifications: Products TEA1532AT and TEA1532AP added:
Updated Section 4 “Ordering information”
Updated Section 6 “Pinning information”
Changed product numbers in Figure 1,Figure 4,Figure 7,Figure 10, and Figure 13
Added note to Figure 1
Modified Figure 6.
TEA1532_1 20040528 Preliminary data sheet - 9397 750 13113 -
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
9397 750 14319 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 4 February 2005 26 of 27
16. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
18. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
19. Trademarks
GreenChip — is a trademark of Koninklijke Philips Electronics N.V.
20. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level Data sheet status [1] Product status[2] [3] Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 4 February 2005
Document number: 9397 750 14319
Published in The Netherlands
Philips Semiconductors TEA1532(A)P; TEA1532(A)T
GreenChipII SMPS control IC
21. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.1 Distinctive features . . . . . . . . . . . . . . . . . . . . . . 1
2.2 Green features . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.3 Protection features . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Functional description . . . . . . . . . . . . . . . . . . . 4
7.1 Start-up, mains enabling operation level and
undervoltage lock out . . . . . . . . . . . . . . . . . . . . 6
7.2 Supply management. . . . . . . . . . . . . . . . . . . . . 6
7.3 Current control mode . . . . . . . . . . . . . . . . . . . . 6
7.4 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
7.5 Cycle skipping. . . . . . . . . . . . . . . . . . . . . . . . . . 7
7.6 Demagnetization (QR operation) . . . . . . . . . . . 7
7.7 Continuous Conduction Mode (CCM). . . . . . . . 7
7.8 OverCurrent Protection (OCP) . . . . . . . . . . . . . 7
7.9 Control pin protection . . . . . . . . . . . . . . . . . . . . 7
7.10 Adjustable slope compensation . . . . . . . . . . . . 7
7.11 Minimum and maximum on-time. . . . . . . . . . . . 8
7.12 PROTECT and timing input . . . . . . . . . . . . . . . 8
7.13 Valley switching. . . . . . . . . . . . . . . . . . . . . . . . . 9
7.14 Brown-out protection. . . . . . . . . . . . . . . . . . . . 10
7.15 OverTemperature protection (OTP) . . . . . . . . 11
7.16 Soft start-up (pin SENSE). . . . . . . . . . . . . . . . 11
7.17 Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12
9 Thermal characteristics. . . . . . . . . . . . . . . . . . 13
10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 13
11 Application information. . . . . . . . . . . . . . . . . . 15
12 Test information. . . . . . . . . . . . . . . . . . . . . . . . 19
12.1 Quality information . . . . . . . . . . . . . . . . . . . . . 19
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20
14 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
14.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 22
14.2 Through-hole mount packages. . . . . . . . . . . . 22
14.2.1 Soldering by dipping or by solder wave . . . . . 22
14.2.2 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 22
14.3 Surface mount packages . . . . . . . . . . . . . . . . 22
14.3.1 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
14.3.2 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 23
14.3.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 23
14.4 Package related soldering information. . . . . . 24
15 Revision history . . . . . . . . . . . . . . . . . . . . . . . 25
16 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 26
17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
18 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
19 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
20 Contact information . . . . . . . . . . . . . . . . . . . . 26

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