PCA8581TD Datasheet by NXP USA Inc.

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Philips Semiconductors PHILIPS
DATA SHEET
Product specification
Supersedes data of 1996 Aug 19
File under Integrated Circuits, IC12
1997 Apr 02
INTEGRATED CIRCUITS
PCA8581; PCA8581C
128 ×8-bit EEPROM with I2C-bus
interface
1997 Apr 02 2
Philips Semiconductors Product specification
128 ×8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C
CONTENTS
1 FEATURES
2 GENERAL DESCRIPTION
3 QUICK REFERENCE DATA
4 ORDERING INFORMATION
5 BLOCK DIAGRAM
6 PINNING
7 CHARACTERISTICS OF THE I2C-BUS
7.1 Bit transfer
7.2 Start and stop conditions
7.3 System configuration
7.4 Acknowledge
7.5 I2C-bus protocol
8 LIMITING VALUES
9 HANDLING
10 DC CHARACTERISTICS
11 AC CHARACTERISTICS
12 APPLICATION INFORMATION
12.2 Application example
12.2 Slave address
12.3 Diode protection
13 PACKAGE OUTLINES
14 SOLDERING
14.1 Introduction
14.2 DIP
14.2.1 Soldering by dipping or by wave
14.2.2 Repairing soldered joints
14.3 SO
14.3.1 Reflow soldering
14.3.2 Wave soldering
14.3.3 Repairing soldered joints
15 DEFINITIONS
16 LIFE SUPPORT APPLICATIONS
17 PURCHASE OF PHILIPS I2C COMPONENTS
1997 Apr 02 3
Philips Semiconductors Product specification
128 ×8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C
1 FEATURES
Operating supply voltage:
4.5 to 5.5 V (PCA8581)
2.5 to 6.0 V (PCA8581C)
Integrated voltage multiplier and timer for writing
(no external components required)
Automatic erase before write
Low standby current; maximum 10 µA
8-byte page write mode
Serial input/output bus (I2C-bus)
Address by 3 hardware address pins
Automatic word address incrementing
Designed for minimum 10000 write cycles per byte
10 years minimum non-volatile data retention
Infinite number of read cycles
Pin and address compatibility to PCF8570C and
PCF8582
Operating ambient temperature: 25 to +85 °C.
2 GENERAL DESCRIPTION
The PCA8581 and PCA8581C are low power CMOS
EEPROMs with standard and wide operating voltages:
4.5 to 5.5 V (PCA8581)
2.5 to 6.0 V (PCA8581C).
In the following text, the generic term ‘PCA8581’ is used to
refer to both types in all packages except when otherwise
specified.
The PCA8581 is organized as 128 words of 8-bytes.
Addresses and data are transferred serially via a two-line
bidirectional bus (I2C-bus). The built-in word address
register is incremented automatically after each written or
read data byte. All bytes can be read in a single operation.
Up to 8 bytes can be written in one operation, reducing the
total write time per byte. Three address pins, A0, A1 and
A2 are used to define the hardware address, allowing the
use of up to 8 devices connected to the bus without
additional hardware.
3 QUICK REFERENCE DATA
4 ORDERING INFORMATION
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VDD supply voltage
PCA8581 4.5 5.5 V
PCA8581C 2.5 6.0 V
IDD supply current (standby) fSCL = 0 Hz 10 µA
Tamb operating ambient temperature 25 +85 °C
Tstg storage temperature without EEPROM retention 65 +150 °C
with EEPROM retention 65 +85 °C
TYPE
NUMBER
PACKAGE
NAME DESCRIPTION VERSION
PCA8581P DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
PCA8581CP DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
PCA8581T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
PCA8581CT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
3333 CECE
1997 Apr 02 4
Philips Semiconductors Product specification
128 ×8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C
5 BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
MLB887
TIMER
WORD
ADDRESS
REGISTER
SHIFT
REGISTER
POWER
ON
RESET
INPUT
FILTER
VOLTAGE
MULTIPLIER
ROW
SELECT
MEMORY
CELL
ARRAY
COLUMN
SELECT MULTIPLEXER
R/W
CONTROL
I C BUS
CONTROL
2
6
5
SCL
SDA
3
A2
2
A1
1
A0
8
VDD
4
VSS 7
TEST
PCA8581
PCA8581C
7
8
6 PINNING
SYMBOL PIN DESCRIPTION
A0 1 hardware address input 0
A1 2 hardware address input 1
A2 3 hardware address input 2
VSS 4 negative supply
SDA 5 serial data input/output
SCL 6 serial clock input
TEST 7 test output can be connected to VSS, VDD or left
open-circuit
VDD 8 positive supply Fig.2 Pin configuration.
f
page
1
2
3
4
8
7
6
5
MLB888
PCA8581
PCA8581C SCL
SDA
A2
A1
A0 VDD
VSS
TEST
1997 Apr 02 5
Philips Semiconductors Product specification
128 ×8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C
7 CHARACTERISTICS OF THE I2C-BUS
The I2C-bus is for bidirectional, two-line communication
between different ICs or modules. The two lines are a
serial data line (SDA) and a serial clock line (SCL). Both
lines must be connected to a positive supply via a pull-up
resistor. Data transfer may be initiated only when the bus
is not busy.
7.1 Bit transfer
One data bit is transferred during each clock pulse.
The data on the SDA line must remain stable during the
HIGH period of the clock pulse as changes in the data line
at this time will be interpreted as a control signal.
Fig.3 Bit transfer.
MBA607
data line
stable;
data valid
change
of data
allowed
SDA
SCL
7.2 Start and stop conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the
clock is HIGH is defined as the start condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is
defined as the stop condition (P).
Fig.4 Definition of START and STOP conditions.
MBA608
SDA
SCL P
STOP condition
SDA
SCL
S
START condition
1997 Apr 02 6
Philips Semiconductors Product specification
128 ×8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C
7.3 System configuration
A device generating a message is a ‘transmitter’, a device receiving a message is the ‘receiver’. The device that controls
the message is the ‘master’ and the devices which are controlled by the master are the ‘slaves’.
Fig.5 System configuration.
MBA605
MASTER
TRANSMITTER /
RECEIVER
SLAVE
RECEIVER
SLAVE
TRANSMITTER /
RECEIVER
MASTER
TRANSMITTER
MASTER
TRANSMITTER /
RECEIVER
SDA
SCL
7.4 Acknowledge
The number of data bytes transferred between the start
and stop conditions from transmitter to receiver is
unlimited. Each byte of eight bits is followed by an
acknowledge bit. The acknowledge bit is a HIGH level
signal put on the bus by the transmitter during which time
the master generates an extra acknowledge related clock
pulse. A slave receiver which is addressed must generate
an acknowledge after the reception of each byte. Also a
master receiver must generate an acknowledge after the
reception of each byte that has been clocked out of the
slave transmitter.
The device that acknowledges must pull down the SDA
line during the acknowledge clock pulse, so that the SDA
line is stable LOW during the HIGH period of the
acknowledge related clock pulse (set-up and hold times
must be taken into consideration). A master receiver must
signal an end of data to the transmitter by not generating
an acknowledge on the last byte that has been clocked out
of the slave. In this event the transmitter must leave the
data line HIGH to enable the master to generate a stop
condition.
Fig.6 Acknowledgement on the I2C-bus.
handbook, full pagewidth
MBA606 - 1
START
condition
S
SCL FROM
MASTER
DATA OUTPUT
BY TRANSMITTER
DATA OUTPUT
BY RECEIVER
clock pulse for
acknowledgement
1289
1997 Apr 02 7
Philips Semiconductors Product specification
128 ×8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C
7.5 I2C-bus protocol
Before any data is transmitted on the I2C-bus, the device which should respond is addressed first. The addressing is
always carried out with the first byte transmitted after the start procedure. The I2C-bus configuration for the different
PCA8581 WRITE and READ cycles is shown in Figs 7, 9 and 10.
After the word address, one-to-eight data bytes can be sent. The address is automatically incremented, but the four
highest address bits (row) are internally latched. Therefore all bytes are written in the same row.
An example of writing eight bytes with word address X 0 0 00000 and six bytes with word address X 0010101 is
shown in Fig.8.
Fig.7 Master transmits to slave receiver (WRITE) mode.
handbook, full pagewidth
S0AXSLAVE ADDRESS WORD ADDRESS A ADATA P
acknowledgement
from slave acknowledgement
from slave acknowledgement
from slave
WRITING
R/W don't
care
auto increment
memory word address
MLB889
n bytes tWR
Fig.8 Writing eight and six bytes with different word addresses.
(1) X = don’t care.
handbook, full pagewidth
MLB890
Word Address (1) Row
0
1
2
3
column
1
4
2
5
3
6
4 5 6
1
7
2
8
3
01234567
X0000000
X0001...
X0010101
X0011...
"’7
1997 Apr 02 8
Philips Semiconductors Product specification
128 ×8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C
To transmit eight bytes in sequential order, begin with the lowest address bits 0 0 0. The data is written after a stop is
detected. The data is only written if complete bytes have been received and acknowledged. Writing takes a time tWR
(6 to 10 ms) during which the device will not respond to its slave address. Note that to write the next row, a new write
operation is required (start, slave address, row address, data and stop).
An unlimited number of data bytes can be read in one operation. The address is automatically incremented. If a read
without setting the word address is performed after a write operation, the address pointer may point at a byte in the row
after the previously written row. This occurs if, during writing, the three lowest address bits (column) rolled over.
Fig.9 Master reads after setting word address (WRITE word address; READ data).
handbook, full pagewidth
S0ASLAVE ADDRESS WORD ADDRESS A ASLAVE ADDRESS
acknowledgement
from slave acknowledgement
from slave acknowledgement
from slave
R/W
X
don't
care
acknowledgement
from master
ADATA
auto increment
memory word address
MLB891
P
no acknowledgement
from master
1DATA
auto increment
memory word address
last byte
R/W
S1
n bytes
at this moment master -
transmitter becomes
master - receiver and
PCA8581(C) slave - receiver
becomes slave - transmitter
Fig.10 Master reads slave immediately after first byte (READ mode).
handbook, full pagewidth
S1A
SLAVE ADDRESS DATA A1DATA
acknowledgement
from slave acknowledgement
from slave acknowledgement
from slave
R/W
auto increment
word address
MBD824
auto increment
word address
n bytes last bytes
P
1997 Apr 02 9
Philips Semiconductors Product specification
128 ×8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C
8 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
9 HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take precautions appropriate to handling MOS devices. Advice can be found in Data Handbook IC12 under
“Handling MOS Devices”
.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VDD supply voltage (pin 8) 0.3 +7.0 V
VIinput voltage (any input) measured via a 500 resistor 0.8 VDD + 0.8 V
IIDC input current −±10 mA
IODC output current −±10 mA
Ptot total power dissipation per package 150 mW
POpower dissipation per output 50 mW
Tamb operating ambient temperature 25 +85 °C
Tstg storage temperature without EEPROM retention 65 +150 °C
with EEPROM retention 65 +85 °C
1997 Apr 02 10
Philips Semiconductors Product specification
128 ×8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C
10 DC CHARACTERISTICS
VDD = 2.5 to 6.0 V (PCA8581C); VDD = 4.5 to 5.5 V (PCA8581); VSS = 0 V; Tamb =25 to +85 °C; note 1; unless
otherwise specified.
Note
1. The PCA8581C is guaranteed to be programmed with all locations ‘FF’ (hexadecimal) provided the device has been
stored within the temperature limits 65 to +85 °C.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
VDD supply voltage
PCA8581C 2.5 6.0 V
PCA8581 4.5 5.5 V
IDD supply current
standby mode fSCL = 0 Hz; VIL = 0 V; VIH = VDD −−10 µA
during read cycle fSCL = 100 Hz; VIL = 0 V; VIH = VDD −−400 µA
during write cycle VIL = 0 V; VIH = VDD −−1000 µA
Inputs A0, A1, A2, SDA and SCL
VIL LOW level input voltage −−0.3VDD V
VIH HIGH level input voltage 0.7VDD −−V
I
LI input leakage current VI=V
DD or VSS −−1µA
C
iinput capacitance VI=V
SS −−7pF
Output SDA
IOL LOW level output current VOL = 0.4 V 3 −−mA
Erase/write data
tWR write time 710ms
t
RET data retention time 10 −−years
1997 Apr 02 11
Philips Semiconductors Product specification
128 ×8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C
11 AC CHARACTERISTICS
All timing values are valid within the operating supply voltage and ambient temperature range and reference to VIL and
VIH with an input voltage swing of VSS to VDD.
Note
1. A detailed description of the I2C-bus specification, with applications, is given in brochure
“The I
2
C-bus and how to
use it”
. This brochure may be ordered using the code 9398 393 40011.
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
I2C-bus timing (see Fig.11; note 1)
fSCL SCL clock frequency −−100 kHz
tSP tolerable spike width on bus −−100 ns
tBUF bus free time 4.7 −−µs
t
SU;STA START condition set-up time 4.7 −−µs
t
HD;STA START condition hold time 4.0 −−µs
t
LOW SCL LOW time 4.7 −−µs
t
HIGH SCL HIGH time 4.0 −−µs
t
rSCL and SDA rise time −−1.0 µs
tfSCL and SDA fall time −−0.3 µs
tSU;DAT data set-up time 250 −−ns
tHD;DAT data hold time 0 −−ns
tVD;DAT SCL LOW to data out valid −−3.4 µs
tSU;STO STOP condition set-up time 4.0 −−µs
Fig.11 I2C-bus timing diagram; rise and fall times refer to VIL and VIH.
handbook, full pagewidth
PROTOCOL
SCL
SDA
MBD820
BIT 0
LSB
(R/W)
tHD;STA tSU;DAT tHD;DAT tVD;DAT tSU;STO
tf
r
t
tBUF
tSU;STA tLOW tHIGH 1 / f SCL
START
CONDITION
(S)
BIT 7
MSB
(A7)
BIT 6
(A6) ACKNOWLEDGE
(A) STOP
CONDITION
(P)
i} E; H:
1997 Apr 02 12
Philips Semiconductors Product specification
128 ×8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C
12 APPLICATION INFORMATION
12.1 Application example
handbook, full pagewidth
MLB893
SCL
SDA
VSS
A1
A0
A2 TEST
PCA8581/PCA8581C
'1010'
SDA
SCL
MASTER
TRANSMITTER/
RECEIVER
VDD
SDA SCL
RR
V
DD
(I C bus)
2
R: pull up resistor
R = r
t
CBUS
VDD
SCL
SDA
VSS
A1
A0
A2 TEST
PCA8581/PCA8581C
'1010'
VDD
VDD
SCL
SDA
VSS
A1
A0
A2 TEST
PCA8581/PCA8581C
'1010'
VDD
1
VDD 1
VDD 1
VDD 1
0
0
0
0
0
Fig.12 Application diagram.
Inputs A0, A1 and A2 must be connected to VDD of VSS but not left open-circuit.
4.‘+ +‘ 41—i—I+ flflflfl 44* ULIUU 4+
1997 Apr 02 13
Philips Semiconductors Product specification
128 ×8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C
12.2 Slave address
The PCA8581 has a fixed combination 1 0 1 0 as group 1, while group 2 is fully programmable (see Fig.13).
12.3 Diode protection
Fig.13 Slave address.
handbook, halfpage
MLB892
1 0 1 0 A2A1A0R/W
group 1 group 2
Fig.14 Device diode protection.
There is no connection between SCL and VDD, and SDA and VDD; this allows powering down the device without affecting I2C-bus operation.
handbook, halfpage
MLB894
SCL
SDA
A2
A1
A0 VDD
VSS
TEST
substrate
a@ 432—144; LJ'uJ‘LLJLJ
1997 Apr 02 14
Philips Semiconductors Product specification
128 ×8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C
13 PACKAGE OUTLINES
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT97-1 92-11-17
95-02-04
UNIT A
max. 12 b
1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.14 0.53
0.38 0.36
0.23 9.8
9.2 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 1.154.2 0.51 3.2
inches 0.068
0.045 0.021
0.015 0.014
0.009
1.07
0.89
0.042
0.035 0.39
0.36 0.26
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0450.17 0.020 0.13
b2
050G01 MO-001AN
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
8
1
5
4
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
1997 Apr 02 15
Philips Semiconductors Product specification
128 ×8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C
UNIT A
max. A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.2
5.8 1.05 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
4
5
pin 1 index
1
8
y
076E03S MS-012AA
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.050 0.244
0.228 0.028
0.024 0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
95-02-04
97-05-22
1997 Apr 02 16
Philips Semiconductors Product specification
128 ×8-bit EEPROM with I2C-bus
interface PCA8581; PCA8581C
14 SOLDERING
14.1 Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
(order code 9398 652 90011).
14.2 DIP
14.2.1 SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
14.2.2 REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
14.3 SO
14.3.1 REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
14.3.2 WAVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
14.3.3 REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Lab (fiL/
1997 Apr 02 17
Philips Semiconductors Product specification
128 ×8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C
15 DEFINITIONS
16 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
17 PURCHASE OF PHILIPS I2C COMPONENTS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1997 Apr 02 18
Philips Semiconductors Product specification
128 ×8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C
NOTES
1997 Apr 02 19
Philips Semiconductors Product specification
128 ×8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C
NOTES
Ldé male My; beflw “21:1? oooooooooo @ PHILIPS
Internet: http://www.semiconductors.philips.com
Philips Semiconductors – a worldwide company
© Philips Electronics N.V. 1997 SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
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Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2870, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101, Fax. +43 1 60 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 1949
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580/xxx
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,
Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
Printed in The Netherlands 417067/1200/03/pp20 Date of release: 1997 Apr 02 Document order number: 9397 750 01747

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