MOC3051M-53M Datasheet by onsemi

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GD 0N Semlconductor® warm-1m mm
© Semiconductor Components Industries, LLC, 2016
May, 2019 Rev. 3
1Publication Order Number:
MOC3052M/D
MOC3051M, MOC3052M,
MOC3053M
6-Pin DIP Random-Phase
Triac Driver Optocoupler
(600 Volt Peak)
The MOC3051M, MOC3052M and MOC3053M consist of a GaAs
infrared emitting diode optically coupled to a nonzero crossing
silicon bilateral AC switch (triac). These devices isolate low voltage
logic from 115 VAC and 240 VAC lines to provide random phase
control of high current triacs or thyristors. These devices feature
greatly enhanced static dv/dt capability to ensure stable switching
performance of inductive loads.
Features
Excellent IFT Stability—IR Emitting Diode Has Low Degradation
600 V Peak Blocking Voltage
Safety and Regulatory Approvals
UL1577, 4,170 VACRMS for 1 Minute
DIN EN/IEC6074755
Typical Applications
Solenoid/Valve Controls
Lamp Ballasts
Static AC Power Switch
Interfacing Microprocessors to 115 VAC and 240 VAC Peripherals
Solid State Relay
Incandescent Lamp Dimmers
Temperature Controls
Motor Controls
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PDIP6
CASE 646BY
PDIP6
CASE 646BZ
PDIP6
CASE 646BX
See detailed ordering, marking and shipping information on
page 9 of this data sheet.
ORDERING INFORMATION
MARKING DIAGRAM
ON = ON Semiconductor Logo
MOC3051 = Device Code
V = DIN EN/IEC6074755 Option
X = OneDigit Year Code
YY = TwoDigit Work Week,
Q = Assembly Package Code
MOC3051
V X YY Q
PIN CONNECTIONS
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SAFETY AND INSULATIONS RATINGS
As per DIN EN/IEC 6074755, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data. Compliance with
the safety ratings shall be ensured by means of protective circuits.
Parameter Characteristics
Installation Classifications per DIN VDE 0110/1.89 Table 1,
For Rated Mains Voltage
< 150 VRMS I–IV
< 300 VRMS I–IV
Climatic Classification 40/85/21
Pollution Degree (DIN VDE 0110/1.89) 2
Comparative Tracking Index 175
Symbol Parameter Value Unit
VPR InputtoOutput Test Voltage, Method A, VIORM x 1.6 = VPR, Type and
Sample Test with tm = 10 s, Partial Discharge < 5 pC
1360 Vpeak
InputtoOutput Test Voltage, Method B, VIORM x 1.875 = VPR,
100% Production Test with tm = 1 s, Partial Discharge < 5 pC
1594 Vpeak
VIORM Maximum Working Insulation Voltage 850 Vpeak
VIOTM Highest Allowable OverVoltage 6000 Vpeak
External Creepage 7 mm
External Clearance 7 mm
External Clearance (for Option TV, 0.4” Lead Spacing) 10 mm
DTI Distance Through Insulation (Insulation Thickness) 0.5 mm
RIO Insulation Resistance at TS, VIO = 500 V > 109W
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MAXIMUM RATINGS TA = 25°C unless otherwise specified.
Symbol Parameter Value Unit
TOTAL DEVICE
TSTG Storage Temperature 40 to +150 °C
TOPR Operating Temperature 40 to +85 °C
TJJunction Temperature Range 40 to +100 °C
TSOL Lead Solder Temperature 260 for 10 seconds °C
PDTotal Device Power Dissipation at 25°C Ambient 330 mW
Derate Above 25°C 4.4 mW/°C
EMITTER
IFContinuous Forward Current 60 mA
VRReverse Voltage 3 V
PDTotal Power Dissipation at 25°C Ambient 100 mW
Derate Above 25°C 1.33 mW/°C
DETECTOR
VDRM OffState Output Terminal Voltage 600 V
ITSM Peak NonRepetitive Surge Current (Single Cycle 60 Hz Sine Wave) 1 A
PDTotal Power Dissipation at 25°C Ambient 300 mW
Derate Above 25°C 4 mW/°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)
INDIVIDUAL COMPONENT CHARACTERISTICS
Symbol Parameters Characteristic Min Typ Max Unit
EMITTER
VFInput Forward Voltage IF = 10 mA 1.18 1.50 V
IRReverse Leakage Current VR = 3 V 0.05 100 mA
DETECTOR
IDRM Peak Blocking Current, Either Direction VDRM = 600 V, IF = 0
(Note 1)
10 100 nA
VTM Peak OnState Voltage, Either Direction ITM = 100 mA peak,
IF = 0
2.2 2.5 V
dv/dt Critical Rate of Rise of OffState Voltage IF = 0, VDRM = 600 V 1000 V/ms
TRANSFER CHARACTERISTICS
Symbol DC Characteristic Test Conditions Device Min Typ Max Unit
IFT LED Trigger Current,
Either Direction
Main Terminal
Voltage = 3 V (Note 2)
MOC3051M 15 mA
MOC3052M 10
MOC3053M 6
IHHolding Current,
Either Direction
All 540 mA
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ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) (continued)
INDIVIDUAL COMPONENT CHARACTERISTICS
Symbol Characteristic Test Conditions Min Typ Max Unit
ISOLATION CHARACTERISTICS
VISO InputOutput Isolation Voltage (Note 3) f = 60 Hz, t = 1 Minute 4170 VACRMS
RISO Isolation Resistance VIO = 500 VDC 1011 W
CISO Isolation Capacitance V = 0 V, f = 1 MHz 0.2 pF
1. Test voltage must be applied within dv/dt rating.
2. All devices will trigger at an IF value greater than or equal to the maximum IFT specification. For optimum operation over temperature and
lifetime of the device, the LED should be biased with an IF that is at least 50% higher than the maximum IFT specification. The IF should not
exceed the absolute maximum rating of 60 mA.
Example: For MOC3052M, the minimum IF bias should be 10 mA x 150% = 15 mA.
3. Isolation voltage, VISO, is an internal device dielectric breakdown rating. For this test, pins 1 and 2 are common, and pins 4, 5 and 6 are
common.
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TYPICAL CHARACTERISTICS
IF LED FORWARD CURRENT (mA)
VF FORWARD VOLTAGE (V)
Figure 1. LED Forward Voltage vs. Forward Current Figure 2. OnState Characteristics
VTM ONSTATE VOLTAGE (V)
ITM ONSTATE CURRENT (mA)
TA AMBIENT TEMPERATURE (°C)
IFT (NORMALIZED) = IFT (TA) / IFT (TA = 25°C)
Figure 3. LED Trigger Current vs. Ambient
Temperature
Figure 4. LED Trigger Current vs. LED Pulse Width
IFT (NORMALIZED) = IFT (PW) / IFT (PW = 100 ms)
PW LED TRIGGER PULSE WIDTH (ms)
TA, AMBIENT TEMPERATURE (°C)
IH (NORMALIZED) = IH (TA) / IH (TA = 25°C)
Figure 5. Holding Current vs. Ambient
Temperature
Figure 6. Leakage Current vs. Ambient
Temperature
IDRM LEAKAGE CURRENT (nA)
TA, AMBIENT TEMPERATURE (°C)
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
400
300
200
100
0
100
200
300
400
0
1
2
3
4
0.1
1
10
100
1000
10000
0.6
0.8
1.0
1.2
1.4
0
5
10
15
NORMALIZED TO PW = 100 μs
1 10 100 322101 23
40 20 0 20 40 60 80 100 1 10 100
40 20 0 20 40 60 80 100 40 20 0 20 40 60 80 100
TA = 40°C
TA = 25°C
TA = 85°C
NORMALIZED TO TA = 25°C
NORMALIZED TO TA = 25°CVDRM = 600 V
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APPLICATIONS INFORMATION
Basic Triac Driver Circuit
The random phase triac drivers MOC3051M,
MOC3052M and MOC3053M can allow snubberless
operations in applications where load is resistive and the
external generated noise in the AC line is below its
guaranteed dv/dt withstand capability. For these
applications, a snubber circuit is not necessary when a noise
insensitive power triac is used. Figure 7 shows the circuit
diagram. The triac driver is directly connected to the triac
main terminal 2 and a series resistor R which limits the
current to the triac driver. Current limiting resistor R must
have a minimum value which restricts the current into the
driver to maximum 1 A.
The power dissipation of this current limiting resistor and
the triac driver is very small because the power triac carries
the load current as soon as the current through driver and
current limiting resistor reaches the trigger current of the
power triac. The switching transition times for the driver is
only one micro second and for power triacs typical four
micro seconds.
Triac Driver Circuit for Noisy Environments
When the transient rate of rise and amplitude are expected
to exceed the power triacs and triac drivers maximum
ratings a snubber circuit as shown in Figure 8 is
recommended. Fast transients are slowed by the RC
snubber and excessive amplitudes are clipped by the Metal
Oxide Varistor MOV.
Triac Driver Circuit for Extremely Noisy Environments
As specified in the noise standards IEEE472 and
IEC2554.
Industrial control applications do specify a maximum
transient noise dv/dt and peak voltage which is
superimposed onto the AC line voltage. In order to pass this
environment noise test a modified snubber network as
shown in Figure 9 is recommended.
LED Trigger Current versus Temperature
Recommended operating LED control current IF lies
between the guaranteed IFT and absolute maximum IF.
Figure 3 shows the increase of the trigger current when the
device is expected to operate at an ambient temperature
below 25°C. Multiply the datasheet guaranteed IFT with the
normalized IFT shown on this graph and an allowance for
LED degradation over time.
Example:
IFT = 10 mA, LED degradation factor = 20%
IF at 40°C = 10 mA × 1.25 × 120% = 15 mA
LED Trigger Current vs. Pulse Width
Random phase triac drivers are designed to be phase
controllable. They may be triggered at any phase angle
within the AC sine wave. Phase control may be
accomplished by an AC line zero cross detector and a
variable pulse delay generator which is synchronized to the
zero cross detector. The same task can be accomplished by
a microprocessor which is synchronized to the AC zero
crossing. The phase controlled trigger current may be a very
short pulse which saves energy delivered to the input LED.
LED trigger pulse currents shorter than 100 ms must have
increased amplitude as shown on Figure 4. This graph shows
the dependency of the trigger current IFT versus the pulse
width. IFT in this graph is normalized in respect to the
minimum specified IFT for static condition, which is
specified in the device characteristic. The normalized IFT
has to be multiplied with the devices guaranteed static
trigger current.
Example:
IFT = 10 mA, Trigger PW = 4 ms
IF (pulsed) = 10 mA × 3 = 30 mA
Minimum LED Off Time in Phase Control Applications
In phase control applications, one intends to be able to
control each AC sine half wave from 0° to 180°. Turn on at
0° means full power and turn on at 180° means zero power.
This is not quite possible in reality because triac driver and
triac have a fixed turn on time when activated at zero
degrees. At a phase control angle close to 180°the drivers
turn on pulse at the trailing edge of the AC sine wave must
be limited to end 200 ms before AC zero cross as shown in
Figure 10. This assures that the triac driver has time to switch
off. Shorter times may cause loss of control at the following
half cycle.
Static dv/dt
Critical rate of rise of offstate voltage or static dv/dt is a
triac characteristic that rates its ability to prevent false
triggering in the event of fast rising line voltage transients
when it is in the offstate. When driving a discrete power
triac, the triac driver optocoupler switches back to offstate
once the power triac is triggered. However, during the
commutation of the power triac in application where the
load is inductive, both triacs are subjected to fast rising
voltages. The static dv/dt rating of the triac driver
optocoupler and the commutating dv/dt rating of the power
triac must be taken into consideration in snubber circuit
design to prevent false triggering and commutation failure.
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MOC3051M, MOC3052M, MOC3053M
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7
Figure 7. Basic Driver Circuit
LOAD
R
TRIAC DRIVER
CONTROL
AC LINE
Q
POWER TRIAC
RET.
VCC RLED
RLED = (VCC VFLED VSATQ) / IFT
R = VPAC / ITSM
Figure 8. Triac Driver Circuit for Noisy Environments
LOAD
R
TRIAC DRIVER
CONTROL
AC LINE
POWER TRIAC
RET.
VCC RLED
MOV
RS
CS
Typical Snubber values RS = 33 W, CS = 0.01 mF
MOV (Metal Oxide Varistor) protects power triac and
driver from transient overvoltages > VDRM max
Figure 9. Triac Driver Circuit for Extremely Noisy Environments
LOAD
R
TRIAC DRIVER
CONTROL
AC LINE
POWER TRIAC
RET.
VCC RLED
MOV
RS
CS
Recommended snubber to pass IEEE472 and IEC2554 noise tests
RS = 47 W, CS = 0.01 mF
Figure 10. Minimum Time for LED Turn Off to Zero Crossing
0° 180°
LED PW
LED Current
LED turn off min. 200 ms
AC Line
Temperature (”C) 260 240 220 200 180 160 140 120 100 80 60 4O 20 Max, Ramp-up Rate : 3°03 TP Max Ramp-down Rate 7 6°08 H 1p TL Tsmax - Rug. Preheat Area > Tsmln > ‘ ts . 1 20 240 360 Tlme 25"C lo Peak Time (seconds) www.0nse
MOC3051M, MOC3052M, MOC3053M
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8
REFLOW PROFILE
Figure 11. Reflow Profile
Profile Feature PbFree Assembly Profile
Temperature Minimum (Tsmin) 150°C
Temperature Maximum (Tsmax) 200°C
Time (tS) from (Tsmin to Tsmax) 60 seconds to 120 seconds
Rampup Rate (TL to TP) 3°C/second maximum
Liquidous Temperature (TL) 217°C
Time (tL) Maintained Above (TL)60 seconds to 150 seconds
Peak Body Package Temperature 260°C +0°C / –5°C
Time (tP) within 5°C of 260°C30 seconds
Rampdown Rate (TP to TL) 6°C/second maximum
Time 25°C to Peak Temperature 8 minutes maximum
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9
ORDERING INFORMATION (Note 4)
Device Package Shipping
MOC3051M DIP 6Pin Tube (50 Units)
MOC3051SM SMT 6Pin (Lead Bend) Tube (50 Units)
MOC3051SR2M SMT 6Pin (Lead Bend) Tape and Reel (1000 Units)
MOC3051VM DIP 6Pin, DIN EN/IEC6074755 Option Tube (50 Units)
MOC3051SVM SMT 6Pin (Lead Bend),
DIN EN/IEC6074755 Option
Tube (50 Units)
MOC3051SR2VM SMT 6Pin (Lead Bend),
DIN EN/IEC6074755 Option
Tape and Reel (1000 Units)
MOC3051TVM DIP 6Pin, 0.4” Lead Spacing,
DIN EN/IEC6074755 Option
Tube (50 Units)
4. The product orderable part number system listed in this table also applies to the MOC3052M and MOC3053M product families.
0N Semiwndudw" m 8.89 8.138.851 FII 7.62 (TYP) 6 60 6.106.60 P|N1 U5 * 0.25-0.36 A g 44 E "9' NOTES: i I 3’ g I ‘ A) NO STANDARD APPLIES TO THIS PACKAGE. (’1 g I B) ALL DIMENSIONS ARE IN MILLIMETERS. ‘ C) DIMENSIONS ARE EXCLUSIVE OE BURRS‘ 038 (MN) I ; MOLD FLASH, AND TIE BAR EXTRUSION 7 m I
PDIP6 8.51x6.35, 2.54P
CASE 646BX
ISSUE O
DATE 31 JUL 2016
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
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PDIP6 8.51X6.35, 2.54P
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PDIP6 8.51x6.35, 2.54P
CASE 646BY
ISSUE A
DATE 15 JUL 2019
A
B
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
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PDIP6 8.51x6.35, 2.54P
CASE 646BZ
ISSUE O
DATE 31 JUL 2016
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
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a a e lrademavks av Semxcunduclm Cnmvnnems In "sine \ghlsmanumhernlpalems \rademavks Dav www menu cumrsuerguwaxem Mavkmg gm 9 www nnserm cum
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