Bergquist

- Henkel’s BERGQUIST® brand thermal management materials include a broad range of solutions for reliability-enhancing heat dissipation within modern electronic devices. The company’s BERGQUIST GAP PAD® gap filling thermal interface materials (TIMs) are soft, compliant, pre-cut pads that reduce assembly stress while providing excellent thermal conductivity. Liquid BERGQUIST Gap Filler TIMs, which can be automatically dispensed, are ideal for applications where complex dimensions are the norm and/or high throughput is required. The expansive thermal solutions portfolio also includes SIL PAD® thermally conductive insulators, BOND PLY® thermal adhesives, HI FLOW® phase change materials and TCLAD® Insulated Metal Substrates (IMS®).

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Newest Products View All (6)

Gap Pad® VO Ultra Soft Publish Date: 2013-10-07

Gap Pad® VO ultra soft for filling air gaps features thermal conductivity of 1.0 W/m-K and is designed for low-stress applications.

Sil-Pad® K-10 Publish Date: 2013-10-07

The Sil-Pad® K-10 Kapton-based insulator offers good cut-through properties and excellent thermal performance.

Gap Pad® 1500 Publish Date: 2013-10-07

Gap Pad® 1500 unreinforced gap-filling material features thermal conductivity of 1.5 W/m-K and conformable, low-hardness.

Q-Pad® 3 Publish Date: 2013-10-07

Q-Pad® 3 glass-reinforced grease replacement thermal interface can be installed prior to soldering and cleaning.

Sil-Pad® 900S Publish Date: 2013-10-07

The Sil-Pad® 900S insulation material features thermal impedance of 0.61°C-in2/W (@50 psi) for applications including power supplies.

Gap Pad HC 5.0 Publish Date: 2016-08-11

A soft and compliant gap filling material, Bergquist's Gap Pad HC 5.0 has a thermal conductivity of 5.0 W/m-K and delivers outstanding thermal performance with very low compression stress.

Recent PTMs View All (5)

LED Thermal Management Publish Date: 2011-10-19

How the insulated metal substrate boards work along with an overview of the T-Clad PA-Bond-Ply 450 thermal interface material.

Duration: 5 minutes
Thermal Interface Materials (TIM) Gap Pad Publish Date: 2013-07-24

An electrically isolating material which provides protection between heat sinks and high voltage devices.

Duration: 5 minutes
Thermal Interface materials (TIM) Gap Pad Key Product Characteristics Publish Date: 2013-11-04

Thermal interface materials (TIM) Gap Pad characteristics including thermal, electrical, and mechanical.

Duration: 15 minutes
Thermal Interface Material (TIM), Gap Pad® VO Ultra Soft Publish Date: 2014-02-18

Gap Pad VO offers a thermally conductive, electrically isolating material with a wide array of secondary benefits.

Duration: 5 minutes

Featured Videos View All (1)

Liquid Dispensed TIM

This animation demonstrates how to combine your Thermal Clad® IMS with Bergquist Liquid Dispensed TIM for an optimal thermal solution.

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