CGA Series, Automotive Grade Catalog

TDK Corporation

View All Related Products | Download PDF Datasheet

Datasheet

SPECIFICATION SPEC. No. A-General-f
D A T E : 2017 Aug.
To
Upon the acceptance of this spec.
previous spec. (C2005-1420)
shall be abolished.
CUSTOMER’S PRODUCT NAME TDK PRODUCT NAME
MULTILAYER CERAMIC CHIP CAPACITORS
CGA Series / Automotive grade
General (Up to 50V)
Mid voltage (100 to 630V)
Please return this specification to TDK representatives.
If orders are placed without returned specification, please allow us to judge that specification is
accepted by your side.
RECEIPT CONFIRMATION
DATE: YEAR MONTH DAY
TDK Corporation
Sales Engineering
Electronic Components
Sales & Marketing Group Electronic Components Business Company
Ceramic Capacitors Business Group
APPROVED Person in charge APPROVED CHECKED Person in charge
Non-Controlled Copy
— 1 —
1. SCOPE
This specification is applicable to chip type multilayer ceramic capacitors with a priority over the
other relevant specifications.
Production places defined in this specification shall be TDK Corporation Japan,
TDK (Suzhou) Co., Ltd and TDK Components U.S.A. Inc.
EXPLANATORY NOTE:
This specification warrant the quality of the ceramic chip capacitor. The chips should be
evaluated or confirmed a state of mounted on your product.
If the use of the chips go beyond the bounds of this specification, we can not afford to guarantee.
2. CODE CONSTRUCTION
(Example)
Catalog Number : CGA4 J 3 X7R 1 C 225 K 125 A B
(Web) (1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
Item Description : CGA4 J 3 X7R 1 C 225 K T xxxx
(1) (2) (3) (4) (5) (6) (7) (11) (12)
(1) Type
*As for dimensions of each product, please refer to detailed information on TDK web.
(2) Thickness
* As for dimension tolerance, please contact with our
sales representative.
Thickness Dimension (mm)
A 0.30
B 0.50
C 0.60
E 0.80
F 0.85
H 1.15
J 1.25
K 1.30
L 1.60
M 2.00
N 2.30
P 2.50
Q 2.80
R 3.20
L
B
G
B
W
T
T
erminal electrode
Ceramic dielectric
Internal electrode
— 2 —
(3) Voltage condition in the life test
(Max. operating Temp./1000h)
Sign Condition
1 Rated Voltage x 1
2 Rated Voltage x 2
3 Rated Voltage x 1.5
4 Rated Voltage x 1.2
(4) Temperature Characteristics (Details are shown in table 1 No.7 at page 4 and No.8 at page 5)
(5) Rated Voltage
Symbol Rated Voltage
2 J DC 630 V
2 W DC 450 V
2 E DC 250 V
2 A DC 100 V
1 H DC 50 V
1 V DC 35 V
1 E DC 25 V
1 C DC 16 V
1 A DC 10 V
0 J DC 6.3 V
(6) Rated Capacitance
Stated in three digits and in units of pico farads (pF).
The first and Second digits identify the first and second significant figures of the capacitance,
the third digit identifies the multiplier.
R is designated for a decimal point.
Example 2R2 2.2pF
225 2,200,000pF
(7) Capacitance tolerance
Symbol Tolerance Capacitance
C ± 0.25 pF
10pF and under
D ± 0.5 pF
J ± 5 %
Over 10pF
K ± 10 %
M ± 20 %
(8) Thickness code (Only Catalog Number)
(9) Package code (Only Catalog Number)
(10) Special code (Only Catalog Number)
(11) Packaging (Only Item Description)
(Bulk is not applicable for CGA1 and CGA2 type.)
Symbol Packaging
B Bulk
T Taping
(12) Internal code (Only Item Description)
— 3 —
3. RATED CAPACITANCE AND TOLERANCE
3.1 Standard combination of rated capacitance and tolerances
Class Temperature
Characteristics Capacitance tolerance Rated capacitance
1 C0G
10pF and
under
C (±0.25pF) 1, 1.5, 2, 2.2, 3, 3.3, 4, 4.7, 5
D (±0.5pF) 6, 6.8, 7, 8, 9, 10
12pF to
10,000pF J (±5 %)
E – 12 series
Over
10,000pF E – 6 series
2
X5R
X7R
X7S
X7T
10uF and
under
K (±10 %)
M (±20 %) E – 6 series
Over 10uF M (±20 %)
3.2 Capacitance Step in E series
E series Capacitance Step
E- 6 1.0 1.5 2.2 3.3 4.7 6.8
E-12 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2
4. OPERATING TEMPERATURE RANGE
T.C. Min. operating
Temperature
Max. operating
Temperature
Reference
Temperature
X5R -55°C 85°C 25°C
C0G
X7R
X7S
X7T
-55°C 125°C 25°C
5. STORING CONDITION AND TERM
5 to 40°C at 20 to 70%RH
6 months Max.
6. P.C. BOARD
When mounting on an aluminum substrate, large case sizes such as CGA6, CGA8 and CGA9
types are more likely to be affected by heat stress from the substrate.
Please inquire separate specification for the large case sizes when mounted on the substrate.
7. INDUSTRIAL WASTE DISPOSAL
Dispose this product as industrial waste in accordance with the Industrial Waste Law.
— 4 —
8. PERFORMANCE
table 1
No. Item Performance Test or inspection method
1 External
Appearance
No defects which may affect
performance.
Inspect with magnifying glass (3×), in case
of CGA1 type, with magnifying glass (10×)
2 Insulation
Resistance
10,000M or 500M·μF min.
(As for the capacitors of rated voltage
16V DC and the item below, 10,000
M or 100M·μF min.,) whichever
smaller.
Apply rated voltage for 60s.
As for the rated voltage 630V DC, apply
500V.
3 Voltage Proof Withstand test voltage without
insulation breakdown or other
damage.
Class Rated
voltage(RV) Apply voltage
1
RV100V 3 × rated voltage
100VRV500V 1.5 × rated voltage
500VRV 1.3 × rated voltage
2
RV100V 2.5 × rated voltage
100VRV500V 1.5 × rated voltage
500VRV 1.3 × rated voltage
A
bove DC voltage shall be applied for 1s.
Charge / discharge current shall not
exceed 50mA.
4 Capacitance Within the specified tolerance.
Class Capacitance Measuring
frequency
Measuring
voltage
Class1
1000pF and
under 1MHz±10%
0.5 - 5 Vrms.
Over 1000pF 1kHz±10%
Class2
10uF and
under 1kHz±10% 1.0±0.2Vrm s
0.5±0.2Vrms.
Over 10uF 120Hz±20% 0.5±0.2Vrms.
5 Q
(Class1)
See No.4 in this table for measuring
condition.
Capacitance Q
30pF and over 1,000 min.
Under 30pF 400+20×C min.
C : Rated capacitance (pF)
6 Dissipation Factor
(Class2)
0.025 max.
0.03 max.
0.05 max.
0.075 max.
0.1 max.
See No.4 in this table for measuring
condition.
For information which product has which
dissipation factor, please see the detail
page of each product on website.
7 Temperature
Characteristics
of Capacitance
(Class1)
Temperature coefficient shall be calculated
based on values at 25°C and 85°C
temperature.
Measuring temperature below 20°C shall
be -10°C and -25°C.
T.C. Temperature Coefficient
C0G 0 ± 30 (ppm/°C)
Capacitance drift within ± 0.2% or
± 0.05pF, whichever larger.
— 5 —
(continued)
No. Item Performance Test or inspection method
8
Temperature
Characteristics
of Capacitance
(Class2)
Capacitance Change (%) Capacitance shall be measured by the
steps shown in the following table after
thermal equilibrium is obtained for each
step.
C be calculated ref. STEP3 reading
No voltage applied
X5R : ± 15
X7R : ± 15
X7S : ± 22 Step Temperature(°C)
X7T : +22, -33 1 Reference temp. ± 2
2 Min. operating temp. ± 3
3 Reference temp. ± 2
4 Max. operating temp. ± 2
Measuring voltage : 0.1, 0.2, 0.5, 1.0Vrms.
For information which product has which
Measuring voltage, please contact with our
sales representative.
9 Robustness of
Terminations
No sign of termination coming
off, breakage of ceramic, or
other abnormal signs.
Reflow solder the capacitors on a
P.C.Board shown in Appendix 1a or
Appendix 1b and apply a pushing force of
17.7N with 10±1s.
(2N is applied for CGA1, CGA2 type)
10 Bending No mechanical damage. Reflow solder the capacitors on
a P.C.Board shown in Appendix 2a or
Appendix 2b and bend it for 2mm. (1mm
is applied for 0.85mm thickness of Class2
items.)
(Unit : mm)
Pushing force
P.C.Board
Capacitor
2
20
50 F
R230
45 45
— 6 —
(continued)
No. Item Performance Test or inspection method
11 Solderability New solder to cover over 75% of
termination.
25% may have pin holes or rough
spots but not concentrated in one
spot.
Ceramic surface of A sections
shall not be exposed due to
melting or shifting of termination
material.
Completely soak both terminations in
solder at the following conditions.
Solder : Sn-3.0Ag-0.5Cu or Sn-37Pb
Temperature:245±5°C(Sn-3.0Ag-0.5Cu)
235±5°C(Sn-37Pb)
Soaking time:3±0.3s(Sn-3.0Ag-0.5Cu)
2±0.2s(Sn-37Pb)
Flux: Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid
solution.
12 Resistance
to solder
heat
External
appearance
No cracks are allowed and
terminations shall be covered at
least 60% with new solder.
Completely soak both terminations in
solder at the following conditions.
260±5°C for 10±1s.
Preheating condition
Temp. : 110 to 140°C
Time : 30 to 60s.
Solder : Sn-3.0Ag-0.5Cu or Sn-37Pb
Flux : Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid
solution.
Leave the capacitors in ambient
condition for 6 to 24h (Class1) or 24±2h
(Class2) before measurement.
Capacitance
Characteristics Change from the
value before test
Class1 C0G
Capacitance drift
within ± 2.5% or
± 0.25pF,
whichever larger.
Class2
X5
X7R
X7S
X7T
± 7.5 %
Q
(Class1)
Meet the initial spec.
D.F.
(Class2)
Meet the initial spec.
Insulation
Resistance
Meet the initial spec.
Voltage
proof
No insulation breakdown or
other damage.
A section
— 7 —
(continued)
No. Item Performance Test or inspection method
13 Vibration External
appearance
No mechanical damage. Reflow solder the capacitors on a
P.C.Board shown in Appendix1 before
testing.
Vibrate the capacitor with following
conditions.
Applied force : 5G max.
Frequency : 10-2000Hz
Duration : 20 min.
Cycle : 12 cycles in each 3 mutually
perpendicular directions.
Capacitance
Characteristics Change from the
value before test
Class1 C0G
Capacitance drift
within ± 2.5% or
± 0.25pF,
whichever larger.
Class2
X5R
X7R
X7S
X7T
± 7.5 %
Q
(Class1)
Meet the initial spec.
D.F.
(Class2)
Meet the initial spec.
14 Temperature
cycle
External
appearance
No mechanical damage. Reflow solder the capacitors on a
P.C.Board shown in Appendix 1a or
Appendix 1b before testing.
Expose the capacitors in the condition
step1 through step 4 and repeat 1,000
times consecutively.
Leave the capacitors in ambient
condition for 6 to 24h (Class 1) or
24±2h (Class 2) before measurement.
Capacitance
Characteristics Change from the
value before test
Class1 C0G
Capacitance drift
within ± 2.5% or
± 0.25pF,
whichever larger.
Class2
X5
X7R
X7S
X7T
± 7.5 %
Q
(Class1)
Meet the initial spec.
D.F.
(Class2)
Meet the initial spec.
Insulation
Resistance
Meet the initial spec.
Voltage
proof
No insulation breakdown or
other damage.
Step Temperature(°C) Time (min.)
1 Min. operating
temp. ±3 30 ± 3
2 Reference Temp. ±2 2 - 5
3 Max. operating
temp. ±2 30 ± 2
4 Reference Temp. ±2 2 - 5
— 8 —
(continued)
No. Item Performance Test or inspection method
15 Moisture
Resistance
(Steady
State)
External
appearance
No mechanical damage. Reflow solder the capacitors on a
P.C.Board shown in Appendix 1a or
Appendix 1b before testing.
Leave at temperature 40±2°C, 90 to
95%RH for 500 +24,0h.
Leave the capacitors in ambient
condition for 6 to 24h (Class1) or
24±2h (Class2) before measurement.
Capacitance
Characteristics Change from the
value before test
Class1 C0G
Capacitance drift
within ± 5% or
± 0.5pF,
whichever larger.
Class2
X5
X7R
X7S
X7T
± 12.5 %
Q
(Class1)
Capacitance Q
30pF and over 350 min.
10pF and over
under 30pF 275+5/2×C min.
Under 10pF 200+10×C min.
C : Rated capacitance (pF)
D.F.
(Class2)
Characteristics
200% of initial spec. max.
Insulation
Resistance
1,000M or 50M·μF min.
(As for the capacitors of rated
voltage 16V DC and item
below, 1,000M or 10M·μF
min.,)
whichever smaller.
16 Moisture
Resistance
External
appearance
No mechanical damage. Reflow solder the capacitors on a
P.C.Board shown in Appendix 1a or
Appendix 1b before testing.
Apply the rated voltage at temperature
85°C and 85%RH for 1000 +24,0h.
Charge/discharge current shall not
exceed 50mA.
Leave the capacitors in ambient
condition for 6 to 24h (Class1) or
24±2h (Class2) before measurement.
Voltage conditioning (only for class 2)
Voltage treat the capacitors under
testing temperature and voltage for 1
hour.
Leave the capacitors in ambient
condition for 24±2h before
measurement.
Use this measurement for initial value.
Capacitance
Characteristics Change from the
value before test
Class1 C0G
Capacitance drift
within ± 7.5% or
± 0.75pF,
whichever larger.
Class2
X5
X7R
X7S
X7T
± 12.5 %
Q
(Class1)
Capacitance Q
30pF and over 200 and over
Under 30pF 100+10/3×C min.
C : Rated capacitance (pF)
D.F.
(Class2)
Characteristics
200% of initial spec. max.
Insulation
Resistance
500M or 25M·μF min.
(As for the capacitors of rated
voltage 16V DC and item
below, 500M or 5M·μF min.,)
whichever smaller.
— 9 —
(continued)
No. Item Performance Test or inspection method
17 Life External
appearance
No mechanical damage. Reflow solder the capacitors on a
P.C.Board shown in Appendix 1a or
Appendix 1b before testing.
Below the voltage shall be applied at
maximum operating temperature ±2°C for
1,000 +48, 0h.
For information which product has which
applied voltage, please contact with our
sales representative.
Charge/discharge current shall not
exceed 50mA.
Leave the capacitors in ambient
condition for 6 to 24h (Class1) or
24±2h (Class2) before measurement.
Voltage conditioning (only for class 2)
Voltage treat the capacitors under
testing temperature and voltage for 1
hour.
Leave the capacitors in ambient
condition for 24±2h before
measurement.
Use this measurement for initial value.
Capacitance
Characteristics Change from the
value before test
Class1 C0G
Capacitance drift
within ± 3% or
± 0.3pF,
whichever larger.
Class2
X5
X7R
X7S
X7T
± 15 %
Q
(Class1)
Capacitance Q
30pF and over 350 and over
10pF and over to
under 30pF 275+5/2×C min.
Under 10pF 200+10×C min.
C : Rated capacitance (pF)
D.F.
(Class2)
Characteristics
200% of initial spec. max.
Insulation
Resistance
1,000M or 50M·μF min.
(As for the capacitors of rated
voltage 16V DC and the item
below, 1,000 M or 10M·μF
min.,) whichever smaller.
*As for the initial measurement of capacitors (Class2) on number 8,12,13,14 and 15 leave capacitors at
150 –10,0°C for 1 hour and measure the value after leaving capacitors for 24±2h in ambient condition.
Applied voltage
Rated voltage x2
Rated voltage x1.5
Rated voltage x1.2
Rated voltage x1
— 10 —
TDK (EIA style) Dimensions (mm)
a b c
CGA1(CC0201) 0.3 0.8 0.3
CGA2(CC0402) 0.4 1.5 0.5
CGA3(CC0603) 1.0 3.0 1.2
CGA4(CC0805) 1.2 4.0 1.65
CGA5(CC1206) 2.2 5.0 2.0
CGA6(CC1210) 2.2 5.0 2.9
CGA8(CC1812) 3.5 7.0 3.7
CGA9(CC2220) 4.5 8.0 5.6
Appendix - 2a
P.C. Board for bending test
Applied for CGA1, CGA2
1.0
c
40
a
b
100
Copper
Solder resist
Appendix - 2b
P.C. Board for bending test
Applied for CGA3, CGA4, CGA5, CGA6, CGA8, CGA9
1.0
c
40
a
b
100
Copper
Solder resist
Appendix - 1a
P.C. Board for reliability test
Applied for CGA1, CGA2, CGA3, CGA4, CGA5
100
c
a
b
40
Copper
Solder resist
(Unitmm)
Appendix - 1b
P.C. Board for reliability test
Applied for CGA6, CGA8, CGA9
100
c
a
b
40
Copper
Solder resist
Slit
(Unit : mm)
(Unit : mm) (Unit : mm)
b
Material : Glass Epoxy ( As per JIS C6484 GE4 )
P.C. Board thickness : Appendix-2a 0.8mm
Appendix-1a, 1b, 2b 1.6mm
Copper ( thickness 0.035mm )
Solder resis
t
— 11 —
9. INSIDE STRUCTURE AND MATERIAL
No. NAME MATERIAL
Class1 Class2
1 Dielectric CaZrO3 BaTiO3
2 Electrode Nickel (Ni)
3
Termination
Copper (Cu)
4 Nickel (Ni)
5 Tin (Sn)
10. RECOMMENDATION
As for CGA6(CC1210), CGA8(CC1812) and CGA9(CC2220) types, It is recommended
to provide a slit (about 1mm wide) in the board under the components to improve washing
Flux. And please make sure to dry detergent up completely before.
11. SOLDERING CONDITION
As for CGA1(CC0201), CGA2(CC0402), CGA6(CC1210) , CGA8(CC1812) and
CGA9(CC2220) types, reflow soldering only.
3
4
5
1 2
12
12. CAUTION
No. Process Condition
1 Operating
Condition
(Storage,
Transportation)
1-1. Storage
1)
2)
3)
4)
5)
The capacitors must be stored in an ambient temperature of 5 to 40
with a relative humidity of 20 to 70%RH. The products should be used
within 6 months upon receipt.
The capacitors must be operated and stored in an environment free of
dew condensation and these gases such as Hydrogen Sulphide, Hydrogen
Sulphate, Chlorine, Ammonia and sulfur.
Avoid storing in sun light and falling of dew.
Do not use capacitors under high humidity and high and low atmospheric
pressure which may affect capacitors reliability.
Capacitors should be tested for the solderability when they are stored for long
time.
1-2. Handling in transportation
In case of the transportation of the capacitors, the performance of the
capacitors
may be deteriorated depending on the transportation condition.
(
Refer to JEITA RCR-2335C 9.2 Handlin
g
in trans
p
ortation
)
2 Circuit design
Caution
2-1. Operating temperature
Operating temperature should be followed strictly within this specification, especially
be careful with maximum temperature.
1)
2)
3
Do not use capacitors above the maximum allowable operating temperature.
Surface temperature including self heating should be below maximum
operating temperature.
(Due to dielectric loss, capacitors will heat itself when AC is applied. Especially
at high frequencies around its SRF, the heat might be so extreme that it may
damage itself or the product mounted on. Please design the circuit so that the
maximum temperature of the capacitors including the self heating to be below
the maximum allowable operating temperature. Temperature rise at capacitor
surface shall be below 20)
The electrical characteristics of the capacitors will vary depending on the
temperature. The capacitors should be selected and designed in taking the
temperature into consideration.
2-2 Operating voltage
1) Operating voltage across the terminals should be below the rated voltage.
When AC and DC are super imposed, V0-P must be below the rated voltage.
——— (1) and (2)
AC or pulse with overshooting, VP-P must be below the rated voltage.
——— (3), (4) and (5)
When the voltage is started to apply to the circuit or it is stopped applying, the
irregular voltage may be generated for a transit period because of resonance
or switching. Be sure to use the capacitors within rated voltage containing
these Irregular voltage.
Voltage (1) DC voltage (2) DCAC voltage (3) AC voltage
Positional
Measurement
(Rated voltage)
V0-P
0
V0-P
0
VP-P
Voltage (4) Pulse voltage (A) (5) Pulse voltage (B)
Positional
Measurement
(Rated voltage)
VP-P
VP-P
!
0
0
0
13
No. Process Condition
2 Circuit design
Caution
2)
3)
Even below the rated voltage, if repetitive high frequency AC or pulse is applied,
the reliability of the capacitors may be reduced.
The effective capacitance will vary depending on applied DC and AC voltages.
The capacitors should be selected and designed in taking the voltages into
consideration.
2-3. Frequency
When the capacitors (Class 2) are used in AC and/or pulse voltages, the
capacitors may vibrate themselves and generate audible sound.
3 Designing
P.C. board
The amount of solder at the terminations has a direct effect on the reliability of the
capacitors.
1)
2)
3)
The greater the amount of solder, the higher the stress on the chip capacitor, and
the more likely that it will break. When designing a P.C. board, determine the
shape and size of the solder lands to have proper amount of solder on the
terminations.
Avoid using common solder land for multiple terminations and provide individual
solder land for each terminations.
Size and recommended land dimensions.
Flow soldering mm
Type
Symbol
CGA3
(CC0603)
CGA4
(CC0805)
CGA5
(CC1206)
A 0.7 - 1.0 1.0 - 1.3 2.1 - 2.5
B 0.8 - 1.0 1.0 - 1.2 1.1 - 1.3
C 0.6 - 0.8 0.8 - 1.1 1.0 - 1.3
Reflow soldering (mm)
Type
Symbol
CGA1
(CC0201)
CGA2
(CC0402)
CGA3
(CC0603)
CGA4
(CC0805)
A 0.25 - 0.35 0.3 - 0.5 0.6 - 0.8 0.9 - 1.2
B 0.2 - 0.3 0.35 - 0.45 0.6 - 0.8 0.7 - 0.9
C 0.25 - 0.35 0.4 - 0.6 0.6 - 0.8 0.9 - 1.2
Type
Symbol
CGA5
(CC1206)
CGA6
(CC1210)
CGA8
(CC1812)
CGA9
(CC2220)
A 2.0 - 2.4 2.0 - 2.4 3.1 - 3.7 4.1 - 4.8
B 1.0 - 1.2 1.0 - 1.2 1.2 - 1.4 1.2 - 1.4
C 1.1 - 1.6 1.9 - 2.5 2.4 - 3.2 4.0 - 5.0
!
A
B
C
Chip capacito
r
Solder land
Solder resist
14
No. Process Condition
3 Designing
P.C.board
4) Recommended chip capacitor layout is as following.
Disadvantage against
bending stress
Advantage against
bending stress
Mounting
face
Perforation or slit
Break P.C.board with
mounted side up.
Perforation or slit
Break P.C.board with
mounted side down.
Chip
arrangement
(Direction)
Mount perpendicularly to
perforation or slit
Perforation or slit
Mount in parallel with
perforation or slit
Perforation or slit
Distance
from slit
Closer to slit is higher
stress
1
(
1
2
)
Away from slit is less
stress
(
1
2
)
15
No. Process Condition
3 Designing
P.C.board
5) Mechanical stress varies according to location of chip capacitors on the P.C.board.
Perforation
The stress in capacitors is in the following order.
A B = C D E
6) Layout recommendation
Example Use of common
solder land
Soldering with
chassis
Use of common
solder land with
other SMD
Need to
avoid
Recommen
-
dation
A
C
D
B
E
Sli
t
Solder resist
2 >
1
2
Chassis
1
Excessive solde
r
Solder
land
Excessive solder
Missing
solder
S
o
ld
er
l
an
d
Lead wire
Solder resist
Solder resist
Lead wire
Solde
r
chi
p
Solder land
Adhesive
PCB
16
No. Process Condition
4 Mounting 4-1. Stress from mounting head
If the mounting head is adjusted too low, it may induce excessive stress in
the chip capacitor to result in cracking. Please take following precautions.
1)
2)
3)
Adjust the bottom dead center of the mounting head to reach on the P.C.board
surface and not press it.
Adjust the mounting head pressure to be 1 to 3N of static weight.
To minimize the impact energy from mounting head, it is important to provide
support from the bottom side of the P.C.board.
See following examples.
Not recommended Recommended
Single
sided
mounting
Double-si
des
mounting
When the centering jaw is worn out, it may give mechanical impact on the capacitors
to cause crack. Please control the close up dimension of the centering jaw and
provide sufficient preventive maintenance and replacement of it.
4-2. Amount of adhesive
Example : CGA4 (CC0805), CGA5 (CC1206)
a 0.2mm min.
b 70 - 100μm
c Do not touch the solder land
aa
b
cc
Crac
k
Solde
r
peeling Crac
k
Support pin
Support pin
17
No. Process Condition
5 Soldering 5-1. Flux selection
Although highly-activated flux gives better solderability, substances which increase
activity may also degrade the insulation of the chip capacitors.
To avoid such degradation, it is recommended following.
1)
2)
3)
It is recommended to use a mildly activated rosin flux (less than 0.1wt% chlorine).
Strong flux is not recommended.
Excessive flux must be avoided. Please provide proper amount of flux.
When water-soluble flux is used, enough washing is necessary.
5-2. Recommended soldering profile by various methods
Wave soldering Reflow soldering
Manual soldering
(Solder iron)
APPLICATION
As for CGA3(CC0603), CGA4(CC0805)
and CGA5(CC1206), applied to wave
soldering and reflow soldering.
As for CGA1(CC0201), CGA2(CC0402),
CGA6(C1210), CGA8(CC1812),
CGA9(CC2220) applied only to reflow
soldering.
*As for peak temperature of manual soldering, please refer“5-6. Solder repair by solder iron”
5-3. Recommended soldering peak temp and peak temp duration
Wave soldering Reflow soldering
Peak temp()Duration(sec.) Peak temp() Duration(sec.)
Sn-Pb Solder 250 max. 3 max. 230 max. 20 max.
Lead Free Solder 260 max. 5 max. 260 max. 10 max.
Recommended solder compositions
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Pea
k
Temp
0
T
Preheating
Soldering
Natural cooling
Over 60 sec. Over 60 sec.
Peak Temp time
Tem p. ( )
0
T
3sec. (As short as possible)
Preheating
Tem p..()
Pea
k
Temp
T
Preheating Soldering
Natural cooling
Over 60 sec.
0
Peak Temp time
Pea
k
Temp
Tem p. ( )
18
No. Process Condition
5 Soldering
5-4. Avoiding thermal shock
1) Preheating condition
Soldering Type
Temp . ()
Wave soldering CGA3(CC0603), CGA4(CC0805),
CGA5(CC1206) T 150
Reflow soldering
CGA1(CC0201), CGA2(CC0402),
CGA3(CC0603), CGA4(CC0805),
CGA5(CC1206)
T 150
CGA6(CC1210), CGA8(CC1812),
CCGA9(CC2220) T 130
Manual soldering
CGA1(CC0201), CGA2(CC0402),
CGA3(CC0603), CGA4(CC0805),
CGA5(CC1206)
T 150
CGA6(CC1210), CGA8(CC1812),
CGA9(CC2220) T 130
2) Cooling condition
Natural cooling using air is recommended. If the chips are dipped into a solvent for
cleaning, the temperature difference (T) must be less than 100.
5-5. Amount of solder
Excessive solder will induce higher tensile force in chip capacitors when temperature
changes and it may result in chip cracking. In sufficient solder may detach the
capacitors from the P.C.board.
Excessive
solder Higher tensile force in chip
capacitor to cause crack
Adequate
Insufficient
solder
Low robustness may cause
contact failure or chip
capacitor comes off the
P.C.board.
5-6. Solder repair by solder iron
1) Selection of the soldering iron tip
Tip temperature of solder iron varies by its type, P.C.board material and solder land
size. The higher the tip temperature, the quicker the operation. However, heat shock
may cause a crack in the chip capacitors.
Please make sure the tip temp. before soldering and keep the peak temp and time in
accordance with following recommended condition. (Please preheat the chip
capacitors with the condition in 5-4 to avoid the thermal shock.)
Recommended solder iron condition
(
Sn-Pb Solder and Lead Free Solder
)
Type Temp . (°C ) Wattage (W) Shape (mm)
CGA1(CC0201)
CGA2(CC0402)
CGA3(CC0603)
CGA4(CC0805)
CGA5(CC1206)
350 max.
20 max. φ3.0 max.
CGA6(CC1210)
CGA8(CC1812)
CGA9(CC2220)
280 max.
Maximum amount
Minimum amount
19
No. Process Condition
5 Soldering
2)
3)
Direct contact of the soldering iron with ceramic dielectric of chip capacitors may
cause crack. Do not touch the ceramic dielectric and the terminations by solder
iron.
It is not recommended to reuse dismounted capacitors. (For soft electrode)
5-7.Soldering rework using spot heater
Heat stress during rework may possibly be reduced by using a spot heater
(also called a “blower”) rather than a soldering iron.
It is applied only to adding solder in the case of insufficient solder amount.
1)
2)
Reworking using a spot heater may suppress the occurrence of cracks in the
capacitor compared to using a soldering iron. A spot heater can heat up a capacitor
uniformly with a small heat gradient which leads to lower thermal
stress caused by quick heating and cooling or localized heating.
Moreover, where ultra-small capacitors are mounted close together on a printed circuit
board, reworking with a spot heater can eliminate the risk of direct contact between
the tip of a soldering iron and a capacitor.
Rework condition
If the blower nozzle of a spot heater is too close to a capacitor. a crack in the capacitor
may occur due to heat stress. Below are recommendations for avoiding such an
occurrence.
Keep more than 5mm between a capacitor and a spot heater nozzle.
The blower temperature of the spot theater shall be lower than 400.
The airflow shall be set as weak as possible.
The diameter of the nozzle is recommended to be 2mm(one-outlet type).The size is
standard and common.
Duration of blowing hot air is recommended to be 10s or less CGA3(CC0603),
CGA4(CC0805), CGA5(CC1206) and 30s or less for CGA6(CC1210),
CGA8(CC1812) and CGA9(CC2220), considering surface area of the capacitor and
melting temperature of solder.
The angle between the nozzle and the capacitor is recommended to be 45degrees in
order to work easily and to avoid partial area heating.
As is the case when using a soldering iron, preheating reduces thermal stress on
capacitors and improves operating efficiency.
Recommended rework conditionConsult the component manufactures for details.
Distance from nozzle 5mm and over
Nozzle angle 45degrees
Nozzle temp. 400 and less
Airflow
Set as weak as possible
(The airflow shall be the minimum value necessary for
solder to melt in the
Conditions mentioned above.)
Nozzle diameter φ2mmone-outlet type
Blowing duration
10s and less (CGA3[CC0603], CGA4[CC0805],
CGA5[CC1206])
30s and less (CGA6[CC1210], CGA8[CC1812],
CGA9[CC2220])
Example of recommended spot heater use
One-outlet type nozzle
Angle : 45degrees
20
No. Process Condition
5 Soldering
3) Amount of solder should be suitable to from a proper fillet shape.
Excess solder causes mechanical and thermal stress on a capacitor and
results in cracks. Insufficient solder causes weak adherence of the capacitor
to the substrate and may result in detachment of a capacitor and deteriorate
reliability of the printed wiring board.
See the example of appropriate solder fillet shape for 5-5.Amount of solder.
5-8. Sn-Zn solder
Sn-Zn solder affects product reliability.
Please contact TDK in advance when utilize Sn-Zn solder.
5-9. Countermeasure for tombstone
The misalignment between the mounted positions of the capacitors and the land
patterns should be minimized. The tombstone phenomenon may occur especially
the capacitors are mounted (in longitudinal direction) in the same direction of the
reflow soldering.
(Refer to JEITA RCR-2335C Annex A (Informative) Recommendations to prevent the
tombstone phenomenon)
6 Cleaning
1)
2)
If an unsuitable cleaning fluid is used, flux residue or some foreign articles may
stick to chip capacitors surface to deteriorate especially the insulation resistance.
If cleaning condition is not suitable, it may damage the chip capacitors.
2)-1. Insufficient washing
(1)
(2)
(3)
Terminal electrodes may corrode by Halogen in the flux.
Halogen in the flux may adhere on the surface of capacitors, and lower the
insulation resistance.
Water soluble flux has higher tendency to have above mentioned problems (1)
and (2).
2)-2. Excessive washing
When ultrasonic cleaning is used, excessively high ultrasonic energy output
can affect the connection between the ceramic chip capacitor's body and the
terminal electrode. To avoid this, following is the recommended condition.
Power : 20W/ max.
Frequency : 40kHz max.
Washing time : 5 minutes max.
2)-3. If the cleaning fluid is contaminated, density of Halogen increases, and it may
bring the same result as insufficient cleaning.
21
No. Process Condition
7 Coating and
molding of the
P.C. board
1)
2)
3)
When the P.C. board is coated, please verify the quality influence on the product.
Please verify carefully that there is no harmful decomposing or reaction gas
emission during curing which may damage the chip capacitors.
Please verify the curing temperature.
8 Handling after
chip mounted
Caution
1)
Please pay attention not to bend or distort the P.C.board after soldering
in handling otherwise the chip capacitors may crack.
Bend Twist
2) Printed circuit board cropping should not be carried out by hand, but by using the
proper tooling. Printed circuit board cropping should be carried out using a board
cropping jig as shown in the following figure or a board cropping apparatus to
prevent inducing mechanical stress on the board.
(1)Example of a board cropping jig
Recommended example: The board should be pushed from the back side,
close to the cropping jig so that the board is not bent and the stress applied to
the capacitor is compressive.
Unrecommended example: If the pushing point is far from the cropping jig and
the pushing direction is from the front side of the board, large tensile stress is
applied to the capacitor, which may cause cracks.
Outline of jig Recommended Unrecommended
!
Printed
circuit
board V-groove
Board
cropping jig
Slot
Printed
circuit
board
Slot
V-groove
Load point
Components
Direction of
load Direction
of load
Components
Printed
circuit
board
Load point
Slot
V-groove
22
No. Process Condition
8 Handling after
chip mounted
Caution
(2)Example of a board cropping machine
An outline of a printed circuit board cropping machine is shown below.
The top and bottom blades are aligned with one another along the lines
with the V-grooves on printed circuit board when cropping the board.
Unrecommended example: Misalignment of blade position between top and
bottom, right and left, or front and rear blades may cause a crack in
the capacitor.
Outline of machine Principle of operation
Recommended
Unrecommended
Top-bottom
misalignment
Left-right
misalignment
Front-rear
misalignment
Top blade
Board
Bottom blade
Top blade
Bottom blade
Top blade
Bottom blade
Top blade
Bottom blade
3)
When functional check of the P.C.board is performed, check pin pressure tends
to be adjusted higher for fear of loose contact. But if the pressure is excessive
and bend the P.C.board, it may crack the chip capacitors or peel the terminations
off. Please adjust the check pins not to bend the P.C.board.
Item Not recommended Recommended
Board
bending
!
Cross-section diagram
Printed circuit board
V-groove Bottom blade
Top blade
Check pin
Termination
peeling Support pin
Check pin
Printed circuit board
Top
blade
V-groove Bottom blade
Top blade
Printed circuit board
23
No. Process Condition
9 Handling of loose
chip capacitors
1) If dropped the chip capacitors may crack. Once dropped do not use it. Especially,
the large case sized chip capacitors are tendency to have cracks easily, so please
handle with care.
2) Piling the P.C.board after mounting for storage or handling, the corner of the P.C.
board may hit the chip capacitors of another board to cause crack.
10 Capacitance aging The capacitors (Class 2) have aging in the capacitance. They may not be used in
precision time constant circuit. In case of the time constant circuit, the evaluation
should be done well.
11 Estimated life and
estimated failure
rate of capacitors
As per the estimated life and the estimated failure rate depend on the temperature
and the voltage. This can be calculated by the equation described in JEITA
RCR-2335C Annex F(Informative) Calculation of the estimated lifetime and the
estimated failure rate (Voltage acceleration coefficient : 3 multiplication rule,
Temperature acceleration coefficient : 10 rule)
The failure rate can be decreased by reducing the temperature and the voltage but
they will not be guaranteed.
Crack
Floor
P.C.board
Crack
24
No. Process Condition
12 Caution during
operation of
equipment
1)
2)
3)
A capacitor shall not be touched directly with bare hands during operation in
order to avoid electric shock.
Electric energy held by the capacitor may be discharged through the human
body when touched with a bare hand.
Even when the equipment is off, a capacitor may stay charged. The capacitor
should be handled after being completely discharged using a resistor.
The terminals of a capacitor shall not be short-circuited by any accidental contact
with a conductive object. A capacitor shall not be exposed to a conductive liquid
such as an acid or alkali solution. A conductive object or liquid, such as acid and
alkali, between the terminals may lead to the breakdown of a capacitor due to
short circuit
Confirm that the environment to which the equipment will be exposed during
transportation and operation meets the specified conditions. Do not to use the
equipment in the following environments.
(1) Environment where a capacitor is spattered with water or oil
(2) Environment where a capacitor is exposed to direct sunlight
(3) Environment where a capacitor is exposed to Ozone, ultraviolet rays or
radiation
(4) Environment where a capacitor exposed to corrosive gas(e.g. hydrogen
sulfide, sulfur dioxide, chlorine. ammonia gas etc.)
(5) Environment where a capacitor exposed to vibration or mechanical shock
exceeding the specified limits.
(6) Atmosphere change with causes condensation
13 Others
Caution
The products listed on this specification sheet are intended for use in general
electronic equipment (AV equipment, telecommunications equipment, home
appliances, amusement equipment, computer equipment, personal equipment, office
equipment, measurement equipment, industrial robots) under a normal operation and
use condition.
The products are not designed or warranted to meet the requirements of the
applications listed below, whose performance and/or quality require a more stringent
level of safety or reliability, or whose failure, malfunction or trouble could cause
serious damage to society, person or property. Please understand that we are not
responsible for any damage or liability caused by use of the products in any of the
applications below or for any other use exceeding the range or conditions set forth in
this specification sheet. If you intend to use the products in the applications listed
below or if you have special requirements exceeding the range or conditions set forth
in this specification, please contact us.
(1) Aerospace/Aviation equipment
(2) Transportation equipment (electric trains, ships, etc.)
(3) Medical equipment (Excepting Pharmaceutical Affairs Law classification Class1, 2)
(4) Power-generation control equipment
(5) Atomic energy-related equipment
(6) Seabed equipment
(7) Transportation control equipment
(8) Public information-processing equipment
(9) Military equipment
(10) Electric heating apparatus, burning equipment
(11) Disaster prevention/crime prevention equipment
(12) Safety equipment
(13) Other applications that are not considered general-purpose applications
When designing your equipment even for general-purpose applications, you are kindly
requested to take into consideration securing protection circuit/device or providing
backup circuits in your equipment.
!
— 25 —
13. PACKAGING LABEL
Packaging shall be done to protect the components from the damage during
transportation and storing, and a label which has the following information shall be
attached.
1) Inspection No.
2) TDK P/N
3) Customer's P/N
4) Quantity
*Composition of Inspection No.
Example F 7 AΟΟ ΟΟΟ
(a) (b) (c) (d) (e)
a) Line code
b) Last digit of the year
c) Month and A for January and B for February and so on. (Skip I)
d) Inspection Date of the month.
e) Serial No. of the day
14. BULK PACKAGING QUANTITY
Total number of components in a plastic bag for bulk packaging : 1,000pcs.
As for CGA1, CGA2 types, not available for bulk packaging.
— 26 —
15. TAPE PACKAGING SPECIFICATION
1. CONSTRUCTION AND DIMENSION OF TAPING
1-1. Dimensions of carrier tape
Dimensions of paper tape shall be according to Appendix 3, 4, 5.
Dimensions of plastic tape shall be according to Appendix 6, 7.
1-2. Bulk part and leader of taping
1-3. Dimensions of reel
Dimensions of Ø178 reel shall be according to Appendix 8, 9.
Dimensions of Ø330 reel shall be according to Appendix 10, 11.
1-4. Structure of taping
2. CHIP QUANTITY
Type Thickness
of chip
Taping
Material
Chip quantity(pcs.)
Ø 178mm reel Ø 330mm reel
CGA1
(
CC0201
)
0.30 mm Pa
p
er 15
,
000 -
CGA2
(
CC0402
)
0.50 mm Pa
p
er 10
,
000 50
,
000
CGA3
(
CC0603
)
0.80 mm Pa
p
er
/
Plastic 4
,
000 10
,
000
CGA4(CC0805)
0.60mm Pa
p
er 4,000 20
,
000
0.85 mm Pa
p
er 10,000
1.25 mm Plastic 2
,
000
CGA5(CC1206)
0.60 mm Paper 4,000
10,000
0.85 mm
1.15 mm
Plastic 2,000
1.30 mm
1.60 mm 8
,
000
CGA6(CC1210)
1.25 mm
Plastic
2,000 8,000
1.60 mm
2.00 mm
1,000 5,000
2.30 mm
2.50 mm
CGA8(CC1812)
1.60 mm
Plastic
1,000
3,000
2.00 mm
2.30 mm
500
2.50 mm
2.80 mm 2,000
3.20 mm
CGA9(CC2220)
1.60 mm
Plastic
1
,
000
3,000
2.00 mm
500
2.30 mm
2.50 mm
Drawing direction Leade
r
400mm min
Bulk
160mm
Chi
p
sBulk
160mm min
Paper carrier tape
Pitch hole
To
p
cover ta
p
e
Bottom cover tape
(Bottom cover tape is not always applied.)
Plastic carrier tape
Top cover tape
Pitch hole
— 27 —
3. PERFORMANCE SPECIFICATIONS
3-1. Fixing peeling strength (top tape)
0.05-0.7N. (See the following figure.)
TYPE 1 (Paper)
TYPE 2 (Plastic)
3-2. Carrier tape shall be flexible enough to be wound around a minimum radius
of 30mm with components in tape.
3-3. The missing of components shall be less than 0.1%
3-4. Components shall not stick to fixing tape.
3-5. The fixing tapes shall not protrude beyond the edges of the carrier tape
not shall cover the sprocket holes.
0~15°
Carrier tape
Top cover tape
Direction of pulling
Direction of cover tape pulling
0~15°
Carrier tape
Top cover tape
Direction of pulling
Direction of cover tape pulling
— 28 —
Appendix 3
Paper Tape
Unitmm
Symbol
Type A B C D E F
CGA1
(CC0201) ( 0.38 ) ( 0.68 ) 8.00 ± 0.30 3.50 ± 0.05 1.75 ± 0.10 2.00 ± 0.05
Symbol
Type G H J t T
CGA1
(CC0201) 2.00 ± 0.05 4.00 ± 0.05 Ø 1.5 +0.10
0 0.35 ± 0.02 0.40 min.
* The values in the parentheses ( ) are for reference.
Appendix 4
Paper Tape
(Unit : mm)
Symbol
Type A B C D E F
CGA2
(CC0402) ( 0.65 ) ( 1.15 ) 8.00 ± 0.30 3.50 ± 0.05 1.75 ± 0.10 2.00 ± 0.05
Symbol
Type G H J T
CGA2
(CC0402) 2.00 ± 0.05 4.00 ± 0.10 Ø 1.5 +0.10
0 0.60 ± 0.05
* The values in the parentheses ( ) are for reference
T
A
J
Pitch hole
HGF
B
E
D
C
t
T
A
J
Pitch hole
HGF
B
E
D C
— 29 —
Appendix 5
Paper Tape
(Unit : mm)
Symbol
Type A B C D E F
CGA3
(CC0603) ( 1.10 ) ( 1.90 )
8.00 ± 0.30 3.50 ± 0.05 1.75 ± 0.10 4.00 ± 0.10
CGA4
(CC0805) ( 1.50 ) ( 2.30 )
CGA5
(CC1206) ( 1.90 ) ( 3.50 )
Symbol
Type G H J T
CGA3
(CC0603)
2.00 ± 0.05 4.00 ± 0.10 Ø 1.5 +0.10
0 1.20 max.
CGA4
(CC0805)
CGA5
(CC1206)
* The values in the parentheses ( ) are for reference.
T HG F
A
C
E
D
Pitch hole J
B
— 30 —
Appendix 6
Plastic Tape
(Unit : mm)
Symbol
Type A B C D E F
CGA3
(CC0603) ( 1.10 ) ( 1.90 )
8.00 ± 0.30
[12.0 ± 0.30]
3.50 ± 0.05
[5.50 ± 0.05]
1.75 ± 0.10 4.00 ± 0.10
CGA4
(CC0805) ( 1.50 ) ( 2.30 )
CGA5
(CC1206) ( 1.90 ) ( 3.50 )
CGA6
(CC1210) ( 2.90 ) ( 3.60 )
Symbol
Type G H J K t Q
CGA3
(CC0603)
2.00 ± 0.05 4.00 ± 0.10 Ø 1.5 +0.10
0
1.50 max.
0.30 max.
Ø 0.50 min.
CGA4
(CC0805) 2.50 max.
CGA5
(CC1206)
CGA6
(CC1210) 3.20 max.
0.60 max.
* The values in the parentheses ( ) are for reference.
* As for 2.5mm thickness products, apply values in the brackets [ ].
t
K
HGF
A
C
E
D
Pitch hole J
B
Q
— 31 —
Appendix 7
Plastic Tape
(Unit : mm)
Symbol
Type A B C D E F
CGA8
(CC1812) ( 3.60 ) ( 4.90 )
12.0 ± 0.30 5.50 ± 0.05 1.75 ± 0.10 8.00 ± 0.10
CGA9
(CC2220) ( 5.40 ) ( 6.10 )
Symbol
Type G H J K t Q
CGA8
(CC1812) 2.00 ± 0.05 4.00 ± 0.10 Ø 1.5 +0.10
0 6.50 max. 0.60 max. Ø 1.50 min.
CGA9
(CC2220)
* The values in the parentheses ( ) are for reference.
t
K
HGF
A
C
E
D
Pitch hole J
B
Q
— 32 —
Appendix 8
CGA1, CGA2, CGA3, CGA4, CGA5, CGA6 ( As for CGA6 type, any thickness of the item except 2.5mm )
(Material : Polystyrene)
(Unit : mm)
Symbol A B C D E W1
Dimension Ø178 ± 2.0 Ø60 ± 2.0 Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 9.0 ± 0.3
Symbol W2 r
Dimension 13.0 ± 1.4 1.0
Appendix 9
CGA6 ( Applied to 2.5mm thickness products ), CGA8, CGA9
(Material : Polystyrene)
(Unit : mm)
Symbol A B C D E W1
Dimension Ø178 ± 2.0 Ø60 ± 2.0 Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 13.0 ± 0.3
Symbol W2 r
Dimension 17.0 ± 1.4 1.0
B
W1
A
E
C
D
r
W2
B
W1
A
E
C
D
r
W2
— 33 —
Appendix 10
CGA1, CGA2, CGA3, CGA4, CGA5, CGA6 ( As for CGA6 type, any thickness of the item except 2.5mm )
(Material : Polystyrene)
(Unit : mm)
Symbol A B C D E W
Dimension
Ø382 max.
(Nominal
Ø330)
Ø50 min. Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 10.0 ± 1.5
Symbol t r
Dimension 2.0 ± 0.5 1.0
Appendix 11
CGA6 (Applied to 2.5mm thickness products), CGA8, CGA9 (Material : Polystyrene)
(Unit : mm)
Symbol A B C D E W
Dimension
Ø382 max.
(Nominal
Ø330)
Ø50 min. Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 14.0 ± 1.5
Symbol t r
Dimension 2.0 ± 0.5 1.0
B
W
A
EC
D
r
t
B
W
A
E
C
D
r
t

Products

CAP CER 0.1UF 25V X7R 0603
Available Quantity1901259
Unit Price0.1
CAP CER 100PF 50V C0G 0402
Available Quantity1838907
Unit Price0.1
CAP CER 0.1UF 16V X7R 0402
Available Quantity812051
Unit Price0.1
CAP CER 1000PF 50V X7R 0402
Available Quantity515204
Unit Price0.1
CAP CER 10000PF 50V X7R 0603
Available Quantity1276667
Unit Price0.1
CAP CER 10000PF 50V X7R 0402
Available Quantity448082
Unit Price0.11
CAP CER 0.1UF 50V X7R 0603
Available Quantity12140544
Unit Price0.1
CAP CER 10000PF 100V X7R 0603
Available Quantity744357
Unit Price0.11
CAP CER 0.047UF 50V X7R 0402
Available Quantity723419
Unit Price0.13
CAP CER 10000PF 10V X7R 0201
Available Quantity817990
Unit Price0.13
CAP CER 470PF 50V X7R 0201
Available Quantity352919
Unit Price0.13
CAP CER 0.022UF 100V X7R 0603
Available Quantity162031
Unit Price0.13
CAP CER 0.22UF 10V X7R 0402
Available Quantity305021
Unit Price0.17
CAP CER 1UF 16V X7R 0603
Available Quantity104827
Unit Price0.15
CAP CER 0.1UF 50V X7R 0402
Available Quantity14388171
Unit Price0.16
CAP CER 1UF 25V X7R 0603
Available Quantity58082
Unit Price0.18
CAP CER 0.1UF 100V X7S 0603
Available Quantity411487
Unit Price0.22
CAP CER 0.1UF 100V X7R 0805
Available Quantity165979
Unit Price0.23
CAP CER 1UF 25V X7R 0805
Available Quantity2797
Unit Price0.26
CAP CER 2.2UF 6.3V X7R 0603
Available Quantity384886
Unit Price0.29